公开(公告)号：US20240006378A1

公开(公告)日：2024-01-04

申请号：US17855145

申请日：2022-06-30

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Zheng Ren ,  Arifur Chowdhury

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/367 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L25/18 ,  H01L23/3675 ,  H01L24/83 ,  H01L24/16 ,  H01L2224/16225 ,  H01L24/32 ,  H01L2224/32245 ,  H05K1/181

Abstract: A die package comprises a substrate comprising a first face and an opposing second face, a first semiconductor die coupled to the first face of the substrate, a second semiconductor die coupled to the first face of the substrate; and a heat spreader, wherein the first semiconductor die is thermally connected to the heat spreader by a first thermal interface material and the second semiconductor die is thermally connected to the heat spreader by a second thermal interface material, wherein the first thermal interface material comprises a first composition and the second thermal interface material comprises a second composition, wherein the first composition has a lower elastic modulus than the second composition under a first specified condition or conditions.