公开(公告)号：US20190045666A1

公开(公告)日：2019-02-07

申请号：US16155817

申请日：2018-10-09

申请人： Intel Corporation

发明人： Zuyang Liang ,  George Hsieh

IPC分类号： H05K7/20 ,  H01L23/42 ,  H01L23/373

摘要： Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

公开(公告)号：US09953909B2

公开(公告)日：2018-04-24

申请号：US15212951

申请日：2016-07-18

申请人： Intel Corporation

发明人： Zuyang Liang ,  Michael Garcia ,  Joshua D. Heppner ,  Srikant Nekkanty

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L23/13

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01R13/2485

摘要： Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.

公开(公告)号：US20170188448A1

公开(公告)日：2017-06-29

申请号：US14757989

申请日：2015-12-24

申请人： Intel Corporation

发明人： Zuyang Liang ,  George Hsieh

IPC分类号： H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0203 ,  H01L23/42 ,  H05K7/2039 ,  H05K2201/06

摘要： Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

公开(公告)号：US10098220B2

公开(公告)日：2018-10-09

申请号：US14757989

申请日：2015-12-24

申请人： Intel Corporation

发明人： Zuyang Liang ,  George Hsieh

IPC分类号： H05K1/02 ,  H05K7/20

摘要： Electronic device heat transfer technology is disclosed. In an example, an electronic device package can include a substrate. The electronic device package can also include a heat transfer component. The electronic device package can further include a heat-generating electronic component coupled to the substrate between the substrate and the heat transfer component. The electronic device package can also include a viscous thermal interface material (TIM) providing a heat transfer pathway between the electronic component and the heat transfer component. In addition, the electronic device package can include a barrier about at least a portion of a periphery of the viscous TIM to maintain the viscous TIM within a confined location in proximity to the electronic component. The TIM is uninterrupted by the barrier within the periphery.

公开(公告)号：US20180019193A1

公开(公告)日：2018-01-18

申请号：US15212951

申请日：2016-07-18

申请人： Intel Corporation

发明人： Zuyang Liang ,  Michael Garcia ,  Joshua D. Heppner ,  Srikant Nekkanty

IPC分类号： H01L23/498 ,  H01L23/13

CPC分类号： H01L23/49816 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01R13/2485

摘要： Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.