公开(公告)号：US20210281286A1

公开(公告)日：2021-09-09

申请号：US17328673

申请日：2021-05-24

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Mwmmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/04 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.