公开(公告)号：US11018713B2

公开(公告)日：2021-05-25

申请号：US16163024

申请日：2018-10-17

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H01L23/04 ,  H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00 ,  H01L23/36 ,  H01L23/498

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US09818672B2

公开(公告)日：2017-11-14

申请号：US14181325

申请日：2014-02-14

Applicant: INTEL IP CORPORATION

Inventor： Michael P. Skinner ,  Sven Albers ,  Harald Gossner ,  Peter Baumgartner ,  Hans-Joachim Barth

IPC: H01L23/467 ,  H01L23/473

CPC classification number: H01L23/467 ,  H01L23/473 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/00

Abstract: Embodiments of flow diversion devices (FDDs) are disclosed herein. An FDD may include a body formed of a body material and a plurality of thermally deformable fins arranged along the body. Individual fins of the plurality of fins may include first and second materials having different coefficients of thermal expansion (CTEs). Other embodiments may be disclosed and/or claimed.

公开(公告)号：US20160359520A1

公开(公告)日：2016-12-08

申请号：US15174545

申请日：2016-06-06

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/66 ,  H01L23/04 ,  H01L23/31 ,  H01L25/00 ,  H01L21/683 ,  H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L23/538

CPC classification number: H04B1/40 ,  H01L21/6835 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6644 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US20210281286A1

公开(公告)日：2021-09-09

申请号：US17328673

申请日：2021-05-24

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Mwmmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/04 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US11024712B2

公开(公告)日：2021-06-01

申请号：US16019585

申请日：2018-06-27

Applicant: Intel IP Corporation

Inventor： Vase Jovanov ,  Peter Baumgartner ,  Gregor Bracher ,  Luis Giles ,  Uwe Hodel ,  Andreas Lachmann ,  Philipp Riess ,  Karl-Henrik Ryden

IPC: H01L29/08 ,  H01L29/06 ,  H01L29/78 ,  H01L29/10 ,  H01L29/66

Abstract: A semiconductor device is proposed. The semiconductor device includes a source region of a field effect transistor having a first conductivity type, a body region of the field effect transistor having a second conductivity type, and a drain region of the field effect transistor having the first conductivity type. The source region, the drain region, and the body region are located in a semiconductor substrate of the semiconductor device and the body region is located between the source region and the drain region. The drain region extends from the body region through a buried portion of the drain region to a drain contact portion of the drain region located at a surface of the semiconductor substrate, the buried portion of the drain region is located beneath a spacer doping region, and the spacer doping region is located within the semiconductor substrate.

公开(公告)号：US10135481B2

公开(公告)日：2018-11-20

申请号：US15174545

申请日：2016-06-06

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/04 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00 ,  H01L23/36 ,  H01L23/498

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US10122420B2

公开(公告)日：2018-11-06

申请号：US14979185

申请日：2015-12-22

Applicant: Intel IP Corporation

Inventor： Thorsten Meyer ,  Andreas Augustin ,  Reinhard Golly ,  Peter Baumgartner

IPC: H04B5/00 ,  H01L23/522 ,  H01L23/528 ,  H01L25/065

Abstract: Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.

公开(公告)号：US20190052301A1

公开(公告)日：2019-02-14

申请号：US16163024

申请日：2018-10-17

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/04 ,  H01L25/065 ,  H01L25/18 ,  H01L23/48 ,  H01L25/00 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L23/36

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.