公开(公告)号：US20190052301A1

公开(公告)日：2019-02-14

申请号：US16163024

申请日：2018-10-17

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/04 ,  H01L25/065 ,  H01L25/18 ,  H01L23/48 ,  H01L25/00 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L23/36

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US20210281286A1

公开(公告)日：2021-09-09

申请号：US17328673

申请日：2021-05-24

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Mwmmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/04 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US09806929B2

公开(公告)日：2017-10-31

申请号：US14569251

申请日：2014-12-12

Applicant: Intel IP Corporation

Inventor： Alessio Farabegoli ,  Bernhard Sogl ,  Jan-Erik Mueller

IPC: H04L27/34 ,  H04L27/26 ,  H04L27/08 ,  H03F1/02 ,  H03F3/189 ,  H04B1/04

CPC classification number: H04L27/2623 ,  H03F1/02 ,  H03F3/189 ,  H03F3/24 ,  H04B1/0475 ,  H04B2001/0408 ,  H04L27/08 ,  H04L27/2614 ,  H04L27/3411

Abstract: Various embodiments include a power amplifier with crest factor reduction embodied by first circuitry for producing a correlated out-of-band noise signal for controlling the adjacent channel leakage ratio (ACLR) of a communication device; and second circuitry for providing an output signal for controlling the error vector magnitude (EVM) of a digital radio. The ACLR and the EVM are concurrently individually controllable. Additional apparatus is described.

公开(公告)号：US11018713B2

公开(公告)日：2021-05-25

申请号：US16163024

申请日：2018-10-17

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H01L23/04 ,  H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00 ,  H01L23/36 ,  H01L23/498

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US20160359520A1

公开(公告)日：2016-12-08

申请号：US15174545

申请日：2016-06-06

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/66 ,  H01L23/04 ,  H01L23/31 ,  H01L25/00 ,  H01L21/683 ,  H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18 ,  H01L23/538

CPC classification number: H04B1/40 ,  H01L21/6835 ,  H01L23/04 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/17 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/96 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6644 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1421 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.

公开(公告)号：US10135481B2

公开(公告)日：2018-11-20

申请号：US15174545

申请日：2016-06-06

Applicant: Intel IP Corporation

Inventor： Edmund Goetz ,  Bernd Memmler ,  Jan-Erik Mueller ,  Peter Baumgartner

IPC: H04B1/40 ,  H01L23/552 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/683 ,  H01L23/04 ,  H01L23/48 ,  H01L23/66 ,  H01L25/00 ,  H01L23/36 ,  H01L23/498

Abstract: Radio frequency shielding within a semiconductor package is described. In one example, a multiple chip package has a digital chip, a radio frequency chip, and an isolation layer between the digital chip and the radio frequency chip. A cover encloses the digital chip and the radio frequency chip.