Abstract:
Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.
Abstract:
A digital-to-analog converter circuit including a plurality of digital-to-analog converter cells is provided. A first digital-to-analog converter cell of the plurality of digital-to-analog converter cells includes a cell control module configured to provide alternatingly a first voltage and a second voltage to a first electrode of a capacitive element of the first digital-to-analog converter cell based on a digital input signal during a predefined time interval. A second digital-to-analog converter cell of the plurality of digital-to-analog converter cells includes a cell control module configured to provide a third voltage to a first electrode of a capacitive element of the second digital-to-analog converter cell during the predefined time interval. The first voltage is higher than an upper threshold voltage corresponding to a first digital threshold level of the digital input signal and the second voltage is lower than a lower threshold voltage corresponding to a second digital threshold level of the digital input signal. The third voltage is constantly between the upper threshold voltage and the lower threshold voltage.
Abstract:
Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.
Abstract:
Embodiments of the invention include a microelectronic device and methods of forming a microelectronic device. In an embodiment the microelectronic device includes a semiconductor die and an inductor that is electrically coupled to the semiconductor die. The inductor may include one or more conductive coils that extend away from a surface of the semiconductor die. In an embodiment each conductive coils may include a plurality of traces. For example, a first trace and a third trace may be formed over a first dielectric layer and a second trace may be formed over a second dielectric layer and over a core. A first via through the second dielectric layer may couple the first trace to the second trace, and a second via through the second dielectric layer may couple the second trace to the third trace.
Abstract:
A digital-to-analog converter circuit including a plurality of digital-to-analog converter cells is provided. A first digital-to-analog converter cell of the plurality of digital-to-analog converter cells includes a cell control module configured to provide alternatingly a first voltage and a second voltage to a first electrode of a capacitive element of the first digital-to-analog converter cell based on a digital input signal during a predefined time interval. A second digital-to-analog converter cell of the plurality of digital-to-analog converter cells includes a cell control module configured to provide a third voltage to a first electrode of a capacitive element of the second digital-to-analog converter cell during the predefined time interval. The first voltage is higher than an upper threshold voltage corresponding to a first digital threshold level of the digital input signal and the second voltage is lower than a lower threshold voltage corresponding to a second digital threshold level of the digital input signal. The third voltage is constantly between the upper threshold voltage and the lower threshold voltage.