公开(公告)号：US11011827B2

公开(公告)日：2021-05-18

申请号：US15977612

申请日：2018-05-11

Applicant: Intel IP Corporation

Inventor： Trang Thai ,  Sidharth Dalmia ,  Raanan Sover ,  Josef Hagn ,  Omer Asaf ,  Simon Svendsen

IPC: H01Q1/24 ,  H01L23/64 ,  H01L23/66

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

公开(公告)号：US20210234260A1

公开(公告)日：2021-07-29

申请号：US17231051

申请日：2021-04-15

Applicant: Intel IP Corporation

Inventor： Trang Thai ,  Sidharth Dalmia ,  Raanan Sover ,  Josef Hagn ,  Omer Asaf ,  Simon Svendsen

IPC: H01Q1/24 ,  H01L23/64 ,  H01L23/66

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.