公开(公告)号：US20210234260A1

公开(公告)日：2021-07-29

申请号：US17231051

申请日：2021-04-15

申请人： Intel IP Corporation

发明人： Trang Thai ,  Sidharth Dalmia ,  Raanan Sover ,  Josef Hagn ,  Omer Asaf ,  Simon Svendsen

IPC分类号： H01Q1/24 ,  H01L23/64 ,  H01L23/66

摘要： Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

公开(公告)号：US11336015B2

公开(公告)日：2022-05-17

申请号：US15939180

申请日：2018-03-28

申请人： Intel IP Corporation

发明人： Trang Thai ,  Sidharth Dalmia

IPC分类号： H01Q9/04 ,  H01Q19/13 ,  H01Q21/00

摘要： Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.

公开(公告)号：US20190305402A1

公开(公告)日：2019-10-03

申请号：US15939806

申请日：2018-03-29

申请人： Intel IP Corporation

发明人： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William James Lambert ,  Benjamin Jann

IPC分类号： H01Q1/24 ,  H01Q9/04 ,  H01Q1/22

摘要： Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11380979B2

公开(公告)日：2022-07-05

申请号：US15939806

申请日：2018-03-29

申请人： Intel IP Corporation

发明人： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William James Lambert ,  Benjamin Jann

IPC分类号： H01Q1/24 ,  H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

摘要： Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11011827B2

公开(公告)日：2021-05-18

申请号：US15977612

申请日：2018-05-11

申请人： Intel IP Corporation

发明人： Trang Thai ,  Sidharth Dalmia ,  Raanan Sover ,  Josef Hagn ,  Omer Asaf ,  Simon Svendsen

IPC分类号： H01Q1/24 ,  H01L23/64 ,  H01L23/66

摘要： Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

公开(公告)号：US20190305430A1

公开(公告)日：2019-10-03

申请号：US15939180

申请日：2018-03-28

申请人： Intel IP Corporation

发明人： Trang Thai ,  Sidharth Dalmia

IPC分类号： H01Q9/04 ,  H01Q21/00 ,  H01Q19/13

摘要： Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: a substrate including an antenna feed structure; an antenna patch, wherein the antenna patch is a millimeter wave antenna patch; and an air cavity between the antenna patch and the substrate.