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公开(公告)号:US11011827B2
公开(公告)日:2021-05-18
申请号:US15977612
申请日:2018-05-11
Applicant: Intel IP Corporation
Inventor: Trang Thai , Sidharth Dalmia , Raanan Sover , Josef Hagn , Omer Asaf , Simon Svendsen
Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.
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公开(公告)号:US11855353B2
公开(公告)日:2023-12-26
申请号:US16933444
申请日:2020-07-20
Applicant: Intel IP Corporation
Inventor: Trang Thuy Thai , Sidharth Dalmia , Jonathan C. Jensen , Josef Hagn , Baljit Singh , Bhagyashree S. Ganore , Daniel Roberts Cox , Evan A. Chenelly
IPC: H01Q1/38 , H01Q21/06 , H01Q13/16 , H01Q1/02 , H01Q1/52 , H01Q5/392 , H01Q1/24 , H01Q9/28 , H01Q19/28 , H01Q21/28 , H01Q9/04
CPC classification number: H01Q21/064 , H01Q1/02 , H01Q1/243 , H01Q1/38 , H01Q1/526 , H01Q5/392 , H01Q9/0414 , H01Q9/28 , H01Q13/16 , H01Q19/28 , H01Q21/28
Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
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公开(公告)号:US20210234260A1
公开(公告)日:2021-07-29
申请号:US17231051
申请日:2021-04-15
Applicant: Intel IP Corporation
Inventor: Trang Thai , Sidharth Dalmia , Raanan Sover , Josef Hagn , Omer Asaf , Simon Svendsen
Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.
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公开(公告)号:US20210075122A1
公开(公告)日:2021-03-11
申请号:US16933444
申请日:2020-07-20
Applicant: Intel IP Corporation
Inventor: Trang Thuy Thai , Sidharth Dalmia , Jonathan C. Jensen , Josef Hagn , Baljit Singh , Bhagyashree S. Ganore , Daniel Roberts Cox , Evan A. Chenelly
IPC: H01Q21/06 , H01Q13/16 , H01Q1/02 , H01Q1/52 , H01Q5/392 , H01Q1/24 , H01Q9/28 , H01Q19/28 , H01Q1/38 , H01Q21/28 , H01Q9/04
Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
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公开(公告)号:US10741932B2
公开(公告)日:2020-08-11
申请号:US16146672
申请日:2018-09-28
Applicant: INTEL IP CORPORATION
Inventor: Trang Thuy Thai , Sidharth Dalmia , Jonathan C. Jensen , Josef Hagn , Baljit Singh , Bhagyashree S. Ganore , Daniel Roberts Cox , Evan A. Chenelly
IPC: H01Q1/02 , H01Q21/06 , H01Q13/16 , H01Q1/52 , H01Q5/392 , H01Q1/24 , H01Q9/28 , H01Q19/28 , H01Q1/38 , H01Q21/28 , H01Q9/04
Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
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6.
公开(公告)号:US20190103682A1
公开(公告)日:2019-04-04
申请号:US16146672
申请日:2018-09-28
Applicant: INTEL IP CORPORATION
Inventor: Trang Thuy Thai , Sidharth Dalmia , Jonathan C. Jensen , Josef Hagn , Baljit Singh , Bhagyashree S. Ganore , Daniel Roberts Cox , Evan A. Chenelly
CPC classification number: H01Q21/064 , H01Q1/02 , H01Q1/243 , H01Q1/38 , H01Q1/526 , H01Q5/392 , H01Q9/0414 , H01Q9/28 , H01Q13/16 , H01Q19/28 , H01Q21/28
Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.
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