公开(公告)号：US20190305402A1

公开(公告)日：2019-10-03

申请号：US15939806

申请日：2018-03-29

Applicant: Intel IP Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William James Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

公开(公告)号：US11380979B2

公开(公告)日：2022-07-05

申请号：US15939806

申请日：2018-03-29

Applicant: Intel IP Corporation

Inventor： Sidharth Dalmia ,  Jonathan Jensen ,  Ozgur Inac ,  Trang Thai ,  William James Lambert ,  Benjamin Jann

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q1/22 ,  H01Q1/38 ,  H01L23/66

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.