公开(公告)号：US20020104369A1

公开(公告)日：2002-08-08

申请号：US10067952

申请日：2002-02-05

Applicant: Interlink Electronics, Inc.

Inventor： Jeffrey R. Baker ,  Carlos S. Sanchez

IPC: G01N007/00

CPC classification number: H01H13/702 ,  G01L1/20 ,  G01L1/205 ,  H01H2201/036 ,  H01H2203/02 ,  H01H2239/01 ,  H05K1/0268 ,  H05K1/11 ,  H05K1/141 ,  H05K1/167 ,  H05K3/249 ,  H05K3/305 ,  H05K3/365 ,  H05K2201/035 ,  H05K2201/09663 ,  H05K2201/10151 ,  H05K2201/2036 ,  H05K2203/0278 ,  Y10T29/49002 ,  Y10T29/49007 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.

Abstract translation: 电子压敏传感器的成本和复杂性通过直接在包含支撑电子器件的印刷电路板上构建这样的传感器来减少。 导电迹线形成在印刷电路板上以限定接触区域。 具有内表面的柔性基板位于接触区域上方。 基本上围绕接触区域的粘合剂间隔件将柔性基板附接到印刷电路板。 至少一个电阻层沉积在柔性衬底内表面上。 在使用中，电阻层响应于施加到柔性衬底的压力而接触至少两个导电迹线，以产生指示所施加的压力的电信号。