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公开(公告)号:US20130338305A1
公开(公告)日:2013-12-19
申请号:US13971613
申请日:2013-08-20
申请人: Intermolecular, Inc.
发明人: Anh Duong , Tony Chiang , Zachary M. Fresco , Nitin Kumar , Chi-I Lang , Jinhong Tong , Anna Tsizelmon
IPC分类号: C09D129/04
CPC分类号: H01L23/5329 , C09D129/04 , H01L21/02063 , H01L21/02074 , H01L21/3105 , H01L21/31058 , H01L21/76814 , H01L21/7682 , H01L21/76826 , H01L21/76829 , H01L2221/1063 , H01L2924/0002 , H01L2924/00
摘要: Methods of modifying a patterned semiconductor substrate are presented including: providing a patterned semiconductor substrate surface including a dielectric region and a conductive region; and applying an amphiphilic surface modifier to the dielectric region to modify the dielectric region. In some embodiments, modifying the dielectric region includes modifying a wetting angle of the dielectric region. In some embodiments, modifying the wetting angle includes making a surface of the dielectric region hydrophilic. In some embodiments, methods further include applying an aqueous solution to the patterned semiconductor substrate surface. In some embodiments, the conductive region is selectively enhanced by the aqueous solution. In some embodiments, methods further include providing the dielectric region formed of a low-k dielectric material. In some embodiments, applying the amphiphilic surface modifier modifies an interaction of the low-k dielectric region with a subsequent process.
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公开(公告)号:US20150001555A1
公开(公告)日:2015-01-01
申请号:US14488712
申请日:2014-09-17
申请人: Intermolecular, Inc.
发明人: Anh Duong , Tony Chiang , Zachary M. Fresco , Nitin Kumar , Chi-I Lang , Jinhong Tong , Anna Tsizelmon
IPC分类号: H01L23/532
CPC分类号: H01L23/5329 , C09D129/04 , H01L21/02063 , H01L21/02074 , H01L21/3105 , H01L21/31058 , H01L21/76814 , H01L21/7682 , H01L21/76826 , H01L21/76829 , H01L2221/1063 , H01L2924/0002 , H01L2924/00
摘要: Methods of modifying a patterned semiconductor substrate are presented including: providing a patterned semiconductor substrate surface including a dielectric region and a conductive region; and applying an amphiphilic surface modifier to the dielectric region to modify the dielectric region. In some embodiments, modifying the dielectric region includes modifying a wetting angle of the dielectric region. In some embodiments, modifying the wetting angle includes making a surface of the dielectric region hydrophilic. In some embodiments, methods further include applying an aqueous solution to the patterned semiconductor substrate surface. In some embodiments, the conductive region is selectively enhanced by the aqueous solution. In some embodiments, methods further include providing the dielectric region formed of a low-k dielectric material. In some embodiments, applying the amphiphilic surface modifier modifies an interaction of the low-k dielectric region with a subsequent process.
摘要翻译: 提出了修改图案化半导体衬底的方法,包括:提供包括电介质区域和导电区域的图案化半导体衬底表面; 以及将两亲表面改性剂施加到所述电介质区域以改变所述电介质区域。 在一些实施例中,修改电介质区域包括改变电介质区域的润湿角度。 在一些实施例中,改变润湿角度包括使介电区域的表面成为亲水性。 在一些实施方案中,方法还包括将水溶液施加到图案化的半导体衬底表面。 在一些实施例中,导电区域被水溶液选择性地增强。 在一些实施例中,方法还包括提供由低k电介质材料形成的电介质区域。 在一些实施方案中,施加两亲表面改性剂修饰低k电介质区域与随后工艺的相互作用。
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公开(公告)号:US09245848B2
公开(公告)日:2016-01-26
申请号:US14488712
申请日:2014-09-17
申请人: Intermolecular, Inc.
发明人: Anh Duong , Tony Chiang , Zachary M. Fresco , Nitin Kumar , Chi-I Lang , Jinhong Tong , Anna Tsizelmon
IPC分类号: H01L23/48 , H01L23/532 , H01L21/02 , H01L21/3105 , H01L21/768 , C09D129/04
CPC分类号: H01L23/5329 , C09D129/04 , H01L21/02063 , H01L21/02074 , H01L21/3105 , H01L21/31058 , H01L21/76814 , H01L21/7682 , H01L21/76826 , H01L21/76829 , H01L2221/1063 , H01L2924/0002 , H01L2924/00
摘要: Methods of modifying a patterned semiconductor substrate are presented including: providing a patterned semiconductor substrate surface including a dielectric region and a conductive region; and applying an amphiphilic surface modifier to the dielectric region to modify the dielectric region. In some embodiments, modifying the dielectric region includes modifying a wetting angle of the dielectric region. In some embodiments, modifying the wetting angle includes making a surface of the dielectric region hydrophilic. In some embodiments, methods further include applying an aqueous solution to the patterned semiconductor substrate surface. In some embodiments, the conductive region is selectively enhanced by the aqueous solution. In some embodiments, methods further include providing the dielectric region formed of a low-k dielectric material. In some embodiments, applying the amphiphilic surface modifier modifies an interaction of the low-k dielectric region with a subsequent process.
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公开(公告)号:US08871860B2
公开(公告)日:2014-10-28
申请号:US13971613
申请日:2013-08-20
申请人: Intermolecular, Inc.
发明人: Anh Duong , Tony Chiang , Zachary M. Fresco , Nitin Kumar , Chi-I Lang , Jinhong Tong , Anna Tsizelmon
IPC分类号: H01L21/02 , H01L21/768 , C09D129/04 , H01L21/3105
CPC分类号: H01L23/5329 , C09D129/04 , H01L21/02063 , H01L21/02074 , H01L21/3105 , H01L21/31058 , H01L21/76814 , H01L21/7682 , H01L21/76826 , H01L21/76829 , H01L2221/1063 , H01L2924/0002 , H01L2924/00
摘要: Methods of modifying a patterned semiconductor substrate are presented including: providing a patterned semiconductor substrate surface including a dielectric region and a conductive region; and applying an amphiphilic surface modifier to the dielectric region to modify the dielectric region. In some embodiments, modifying the dielectric region includes modifying a wetting angle of the dielectric region. In some embodiments, modifying the wetting angle includes making a surface of the dielectric region hydrophilic. In some embodiments, methods further include applying an aqueous solution to the patterned semiconductor substrate surface. In some embodiments, the conductive region is selectively enhanced by the aqueous solution. In some embodiments, methods further include providing the dielectric region formed of a low-k dielectric material. In some embodiments, applying the amphiphilic surface modifier modifies an interaction of the low-k dielectric region with a subsequent process.
摘要翻译: 提出了修改图案化半导体衬底的方法,包括:提供包括电介质区域和导电区域的图案化半导体衬底表面; 以及将两亲表面改性剂施加到所述电介质区域以改变所述电介质区域。 在一些实施例中,修改电介质区域包括改变电介质区域的润湿角度。 在一些实施例中,改变润湿角度包括使介电区域的表面成为亲水性。 在一些实施方案中,方法还包括将水溶液施加到图案化的半导体衬底表面。 在一些实施例中,导电区域被水溶液选择性地增强。 在一些实施例中,方法还包括提供由低k电介质材料形成的电介质区域。 在一些实施方案中,施加两亲表面改性剂修饰低k电介质区域与随后工艺的相互作用。
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