THICKNESS CALIBRATION OF AN EMBOSSING DIE
    4.
    发明申请
    THICKNESS CALIBRATION OF AN EMBOSSING DIE 有权
    厚度测量仪的厚度校准

    公开(公告)号:US20140058694A1

    公开(公告)日:2014-02-27

    申请号:US13593711

    申请日:2012-08-24

    IPC分类号: G01C25/00

    摘要: There is disclosed a computer program product for carrying out a method of calibrating a thickness of an embossing die, the embossing die being formed from a plurality of ink layers printed by an apparatus. According to the method, an average thickness of an ink layer printed by the apparatus may be calculated, and a target die thickness may be calculated as a function of the average ink layer thickness. A system for implementing a method of calibrating a thickness of an embossing die and a method of measuring a thickness of an embossing die are also disclosed.

    摘要翻译: 公开了一种用于执行校准压纹模具的厚度的方法的计算机程序产品,压印模具由由设备印刷的多个油墨层形成。 根据该方法,可以计算由该装置印刷的油墨层的平均厚度,并且可以根据平均油墨层厚度来计算目标模具厚度。 还公开了一种用于实现校准压纹模具的厚度的方法的系统和测量压花模具的厚度的方法。