摘要:
A micromechanical pipetting device comprising an integrally built pipetting module which has an inlet/outlet which may be connected to a removable pipetting tip or integrally built with a pipetting tip. The pipetting module comprises a micromechanical structure which is integrally built on a silicon wafer. In order to improve the accuracy of the pipetted volume the device is characterized in that it comprises a) a first chamber located within said pipetting module, the volume comprised within said first chamber being alterable by displacement of a membrane which is a portion of a wall of said chamber, said first chamber having an opening, said opening being permanently open and allowing fluid flow into and from the interior of said first chamber, b) a channel located within said pipetting module, said channel establishing a direct, valveless and permanent fluidical connection between said opening of the first chamber and the inlet/outlet of the pipetting module, c) actuator means for displacing said membrane, and thereby aspiring or expelling a volume of air or of a liquid into or from said first chamber, which in turn causes aspiring or expelling a volume of a liquid sample into respectively from said pipetting tip, and d) first sensor means for generating a first output signal related to the displacement of the membrane.
摘要:
The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.
摘要:
The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.
摘要:
A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.
摘要:
A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.