Micromechanical pipetting device
    1.
    发明授权
    Micromechanical pipetting device 失效
    微机械移液装置

    公开(公告)号:US06407437B1

    公开(公告)日:2002-06-18

    申请号:US09044735

    申请日:1998-03-19

    IPC分类号: H01L2984

    摘要: A micromechanical pipetting device comprising an integrally built pipetting module which has an inlet/outlet which may be connected to a removable pipetting tip or integrally built with a pipetting tip. The pipetting module comprises a micromechanical structure which is integrally built on a silicon wafer. In order to improve the accuracy of the pipetted volume the device is characterized in that it comprises a) a first chamber located within said pipetting module, the volume comprised within said first chamber being alterable by displacement of a membrane which is a portion of a wall of said chamber, said first chamber having an opening, said opening being permanently open and allowing fluid flow into and from the interior of said first chamber, b) a channel located within said pipetting module, said channel establishing a direct, valveless and permanent fluidical connection between said opening of the first chamber and the inlet/outlet of the pipetting module, c) actuator means for displacing said membrane, and thereby aspiring or expelling a volume of air or of a liquid into or from said first chamber, which in turn causes aspiring or expelling a volume of a liquid sample into respectively from said pipetting tip, and d) first sensor means for generating a first output signal related to the displacement of the membrane.

    摘要翻译: 一种微机械移液装置,其包括一体式构造的移液模块,其具有可连接到可移动移液末端或与移液头一体构建的入口/出口。 移液模块包括一体地构建在硅晶片上的微机械结构。 为了提高吸移体积的精度,该装置的特征在于它包括:a)位于所述移液模块内的第一腔室,包含在所述第一腔室内的体积可以通过膜的位移而变化,所述膜是壁的一部分 所述腔室,所述第一腔室具有开口,所述开口永久地打开并允许流体流入和流出所述第一腔室的内部,b)位于所述移液模块内的通道,所述通道建立直接,无阀和永久的流体连接 在所述第一室的所述开口和所述移液模块的入口/出口之间,c)用于移动所述膜的致动器装置,从而将一定体积的空气或液体向所述第一室吸入或排出, 分别从所述移液头吸取或排出体积的液体样品,以及d)用于产生与t相关的第一输出信号的第一传感器装置 他的膜的位移。

    Actuator coupling system and a pipetting module comprising such a coupling system
    2.
    发明授权
    Actuator coupling system and a pipetting module comprising such a coupling system 失效
    执行器联接系统和包括这种联接系统的移液模块

    公开(公告)号:US07125519B1

    公开(公告)日:2006-10-24

    申请号:US10148149

    申请日:2000-11-21

    IPC分类号: B01L3/00

    摘要: The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.

    摘要翻译: 本发明涉及一种将大型致动器耦合到微加工装置的可移动元件的系统。 该系统包括微加工装置,用于保持大致动器的第一主体,机械地安装在第一主体上的大致动器,具有用于容纳第一主体的孔的第二主体,用于将第一主体的轴向位置固定在第一主体内的螺钉装置 第二主体的孔,以及用于将微加工装置安装在第二主体上的板装置。 板装置以这样的方式安装,使得大致动器对微加工装置的可移动元件施加预定的力或压力。 本发明还涉及一种包括微加工装置和大型致动器的移液模块。

    Actuator Coupling System and a Pipetting Module Comprising Such a Coupling System
    3.
    发明申请
    Actuator Coupling System and a Pipetting Module Comprising Such a Coupling System 审中-公开
    执行器耦合系统和包括这种耦合系统的移液模块

    公开(公告)号:US20060281213A1

    公开(公告)日:2006-12-14

    申请号:US11466336

    申请日:2006-08-22

    IPC分类号: H01L21/00 H01L29/82

    摘要: The present invention is directed a system for coupling a macroactuator to a movable element of a micromachined device. The system includes a micromachined device, a first body for holding a macroactuator, a macroactuator mechanically mounted on the first body, a second body having a bore for receiving the first body, a screw arrangement for fixing the axial position of the first body within the bore of the second body, and a plate arrangement for mounting the micromachined device on the second body. The plate arrangement is mounted in such a way that the macroactuator exerts a predetermined force or pressure on a movable element of the micromachined device. The present invention further is directed to a pipetting module that includes the micromachined device and the macroactuator.

    摘要翻译: 本发明涉及一种将大型致动器耦合到微加工装置的可移动元件的系统。 该系统包括微加工装置,用于保持大致动器的第一主体,机械地安装在第一主体上的大致动器,具有用于容纳第一主体的孔的第二主体,用于将第一主体的轴向位置固定在第一主体内的螺钉装置 第二主体的孔,以及用于将微加工装置安装在第二主体上的板装置。 板装置以这样的方式安装,使得大致动器对微加工装置的可移动元件施加预定的力或压力。 本发明还涉及一种包括微加工装置和大型致动器的移液模块。

    Thermal flow sensor having recesses in a substrate

    公开(公告)号:US20060000273A1

    公开(公告)日:2006-01-05

    申请号:US10881771

    申请日:2004-06-30

    IPC分类号: G01F1/68

    CPC分类号: G01F1/6845

    摘要: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.

    Thermal flow sensor having recesses in a substrate
    5.
    发明授权
    Thermal flow sensor having recesses in a substrate 有权
    热流量传感器在基板中具有凹槽

    公开(公告)号:US07036369B2

    公开(公告)日:2006-05-02

    申请号:US10881771

    申请日:2004-06-30

    IPC分类号: G01F1/68

    CPC分类号: G01F1/6845

    摘要: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.

    摘要翻译: 热流传感器具有第一,第二和第三基板,每个具有第一侧和第二相对侧。 第一基板连接到第二基板,使得第一基板的第二面邻接第二基板的第一侧。 第三基板连接到第二基板,使得第二基板的第二侧邻接第三基板的第一侧。 第二基板具有形成在其中的槽,以便形成由第二基板和第一基板的第二侧和第三基板的第一侧限定的导管。 加热器设置在与导管相对的第一基板的第一侧上。 第一温度传感器设置在与导管相对的第一基板的第一侧上。 第二温度传感器设置在与导管相对的第一基板的第一侧上。 在加热器和第一温度传感器和第二温度传感器中的一个之间的第一基板的第一侧和第二侧中的至少一个中形成第一凹部。