Thermal flow sensor having recesses in a substrate

    公开(公告)号:US20060000273A1

    公开(公告)日:2006-01-05

    申请号:US10881771

    申请日:2004-06-30

    IPC分类号: G01F1/68

    CPC分类号: G01F1/6845

    摘要: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.

    Thermal flow sensor having recesses in a substrate
    2.
    发明授权
    Thermal flow sensor having recesses in a substrate 有权
    热流量传感器在基板中具有凹槽

    公开(公告)号:US07036369B2

    公开(公告)日:2006-05-02

    申请号:US10881771

    申请日:2004-06-30

    IPC分类号: G01F1/68

    CPC分类号: G01F1/6845

    摘要: A thermal flow sensor has a first, second and third substrate, each having a first side and a second opposite side. The first substrate is connected to the second substrate such that the second side of the first substrate abuts the first side of the second substrate. The third substrate is connected to the second substrate such that the second side of the second substrate abuts the first side of the third substrate. The second substrate has a groove formed therein so as to form a conduit bounded by the second substrate and the second side of the first substrate and the first side of the third substrate. A heater is disposed on the first side of the first substrate opposed to the conduit. A first temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A second temperature sensor is disposed on the first side of the first substrate opposed to the conduit. A first recess is formed in at least one of the first side and the second side of the first substrate between the heater and one of the first temperature sensor and the second temperature sensor.

    摘要翻译: 热流传感器具有第一,第二和第三基板,每个具有第一侧和第二相对侧。 第一基板连接到第二基板,使得第一基板的第二面邻接第二基板的第一侧。 第三基板连接到第二基板,使得第二基板的第二侧邻接第三基板的第一侧。 第二基板具有形成在其中的槽,以便形成由第二基板和第一基板的第二侧和第三基板的第一侧限定的导管。 加热器设置在与导管相对的第一基板的第一侧上。 第一温度传感器设置在与导管相对的第一基板的第一侧上。 第二温度传感器设置在与导管相对的第一基板的第一侧上。 在加热器和第一温度传感器和第二温度传感器中的一个之间的第一基板的第一侧和第二侧中的至少一个中形成第一凹部。

    ULTRA-THIN MULTI-LAYER PROTECTION
    5.
    发明申请
    ULTRA-THIN MULTI-LAYER PROTECTION 有权
    超薄多层保护

    公开(公告)号:US20110039050A1

    公开(公告)日:2011-02-17

    申请号:US12854298

    申请日:2010-08-11

    IPC分类号: B32B3/00 B05D3/00

    摘要: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

    摘要翻译: 一种可植入医疗装置,其包括在基底上的多个部件,以及通过气相沉积施加的生物相容性多层涂层以符合和密封地覆盖部件和/或基底的至少一部分。 涂层涂覆至少两组,每组具有第一层,第二层和第三层。 第一层,第二层和第三层中的至少一层基本上由聚合物如聚对二甲苯组成,并且该组的另外两层中的至少一层基本上由无机材料组成,使得每个层在至少一个扩散阻挡性质与 该组中的其它层并且增加了涂层的整体屏障效应。

    Ultra-thin multi-layer packaging
    6.
    发明授权
    Ultra-thin multi-layer packaging 有权
    超薄多层包装

    公开(公告)号:US08313819B2

    公开(公告)日:2012-11-20

    申请号:US12854298

    申请日:2010-08-11

    IPC分类号: B32B3/00 B05D3/00

    摘要: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two sets, each set having first, second and third layers. At least one of the first, second and third layers consist essentially of a polymer such as parylene and at least one of the other two layers of the set consist essentially of inorganic material such that each layer differs in at least one diffusion barrier property from the other layers in the set and adds to an overall barrier effect of the coating.

    摘要翻译: 一种可植入医疗装置,其包括在基底上的多个部件,以及通过气相沉积施加的生物相容性多层涂层以符合和密封地覆盖部件和/或基底的至少一部分。 涂层涂覆至少两组,每组具有第一层,第二层和第三层。 第一层,第二层和第三层中的至少一层基本上由聚合物如聚对二甲苯组成,并且该组的另外两个层中的至少一层基本上由无机材料组成,使得每个层在至少一个扩散阻挡性质与 该组中的其它层并且增加了涂层的整体屏障效应。

    Plasma enhanced polymer ultra-thin multi-layer packaging
    8.
    发明授权
    Plasma enhanced polymer ultra-thin multi-layer packaging 有权
    等离子体增强聚合物超薄多层包装

    公开(公告)号:US08313811B2

    公开(公告)日:2012-11-20

    申请号:US12854304

    申请日:2010-08-11

    摘要: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapor deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.

    摘要翻译: 一种可植入医疗装置,其包括在基底上的多个部件,以及生物相容的多层聚合物涂层,其通过气相沉积施加以符合和密封地覆盖部件和/或基底的至少一部分。 涂层以至少两对层施加,其中每一对具有通过前体解离形成的一层,然后简单沉积该前体,另一层通过前体的等离子体解离和激发中的至少一种形成 以形成等离子体增强的前体,然后沉积等离子体增强的前体。

    PLASMA ENHANCED POLYMER ULTRA-THIN MULTI-LAYER PACKAGING
    9.
    发明申请
    PLASMA ENHANCED POLYMER ULTRA-THIN MULTI-LAYER PACKAGING 有权
    等离子体增强聚合物超薄多层包装

    公开(公告)号:US20110038130A1

    公开(公告)日:2011-02-17

    申请号:US12854304

    申请日:2010-08-11

    IPC分类号: H05K5/00 C23C16/50

    摘要: An implantable medical device including a plurality of components on a substrate, and a biocompatible multi-layer polymeric coating applied by vapour deposition to conform to and sealingly cover at least a portion of the components and/or the substrate. The coating is applied in at least two pairs of layers, wherein each pair has one layer formed by dissociation of a precursor and then simple deposition of that precursor, and the other layer is formed by at least one of plasma dissociation and excitation of the precursor to form a plasma-enhanced precursor, and then deposition of the plasma-enhanced precursor.

    摘要翻译: 一种可植入医疗装置,其包括在基底上的多个部件,以及生物相容的多层聚合物涂层,其通过气相沉积施加以符合和密封地覆盖部件和/或基底的至少一部分。 涂层以至少两对层施加,其中每对具有通过解离前体形成的一层,然后简单沉积该前体,另一层通过前体的等离子体解离和激发中的至少一种形成 以形成等离子体增强的前体,然后沉积等离子体增强的前体。