公开(公告)号：US20040202864A1

公开(公告)日：2004-10-14

申请号：US10792859

申请日：2004-03-05

Applicant: JAPAN EPOXY RESINS CO., LTD.

Inventor： Yasuyuki Murata ,  Atsuhito Hayakawa ,  Akihiro Itou

IPC: B32B027/38 ,  C08L063/00

CPC classification number: C08G59/04 ,  Y10T428/24264 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/31511

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1null0 in the following general formula (1) and/or components of n2null0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1null0 in the following general formula (1) and/or components of n2null0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation. 1

Abstract translation: 颗粒状环氧树脂通过在常温下粉碎固体的环氧树脂制成，并且由于其熔体粘度低，其中分子量为500以下的组分的总含量为n < 以下通式（1）中的1≤0= 0，和/或以下通式（2）中n 2 = 0的成分为全部环氧树脂的50质量％以上， 以下通式（1）中n 1 = 0的成分中的分子量为400以下的成分和/或下述通式（2）中的n 2 = 0的成分为20质量％ 更多的是整个环氧树脂。 粒状环氧树脂中分子量为200以下的低分子量化合物的含量为0.3质量％以下。 颗粒状环氧树脂容易处理，因为它在储存和运输过程中几乎不会堵塞。

公开(公告)号：US20020123602A1

公开(公告)日：2002-09-05

申请号：US10012323

申请日：2001-12-12

Applicant: Japan Epoxy Resins Co., Ltd.

Inventor： Yasuyuki Murata ,  Masayuki Tsutsumi ,  Kiyotaka Ikebata ,  Ken Tanaka

IPC: C08G065/08

CPC classification number: C08G59/063 ,  C08G59/245

Abstract: A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4null-dihydroxy-3,3null,5,5null-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50null C. and 130null C. to an endotherm between 80null C. and 125null C., measured by raising the temperature at a rate of 10null C. per minute using a DSC device, is 1.03 or more.

Abstract translation: 容易与硬化剂等混合的结晶环氧树脂是由4,4'-二羟基-3,3'，5,5'-四甲基联苯和表卤代醇衍生的环氧树脂的结晶产物，其比例 通过使用DSC装置以每分钟10℃的速度升高的温度来测量，在50℃和130℃之间的吸热至80℃和125℃之间的吸热是1.03或 更多。

公开(公告)号：US20020077422A1

公开(公告)日：2002-06-20

申请号：US09977415

申请日：2001-10-16

Applicant: Japan Epoxy Resins Co., Ltd.

Inventor： Yasuyuki Murata

IPC: C08F008/00

CPC classification number: C08G59/145 ,  C08G59/245 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4null-dihydroxy-3,3null, 5,5null-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): 1 of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.

Abstract translation: 本发明提供四甲基联苯型高性能环氧树脂组合物和含有环氧树脂的可固化环氧树脂组合物，可用于电气和电子领域等。 四甲基联苯型环氧树脂组合物包含在碱金属化合物的存在下使4,4'-二羟基-3,3'，5,5'-四甲基联苯与表卤代醇反应得到的环氧树脂组合物。 该组合物的四甲基联苯醌的含量为0.5重量％以下，由以下结构式（1）表示的缩水甘油基化合物的含量为0.5重量％以下。 可固化环氧树脂组合物含有环氧树脂组合物和用于环氧树脂的固化剂。