公开(公告)号：US20040265597A1

公开(公告)日：2004-12-30

申请号：US10873379

申请日：2004-06-21

Inventor： Hans-Josef Laas ,  Christoph Gurtler ,  Reinhard Halpaap ,  Michael Grahl ,  Peter Thometzek ,  James Rawlins

IPC: B32B027/38 ,  C08L063/00 ,  B32B027/30

CPC classification number: C09D5/03 ,  C08G59/18 ,  C08G59/42 ,  Y10S525/934 ,  Y10T428/31511 ,  Y10T428/31935 ,  Y10T428/31938

Abstract: The invention relates to the use of special mixtures of at least two polycarboxylic acids as crosslinker components for thermally curing powder-lacquer binding agents having groups that are capable of reacting with carboxyl groups. The mixtures include at least two polycarboxylic acids each melting above 95null C. and having up to 20 carbon atoms and consist of at least 5 wt. %, of the polycarboxylic acid with the lowest melting point and at least 10 wt. %, of the polycarboxylic acid with the highest melting point of all polycarboxylic acids present in the mixture to at least 5 wt. %. Additionally, the polycarboxylic acid mixture is a solid below 40null C. and a liquid above 160null C.

Abstract translation: 本发明涉及使用至少两种多元羧酸的特殊混合物作为交联剂组分，用于热固化具有能够与羧基反应的基团的粉末 - 粘合剂。 所述混合物包括至少两种各自在95℃以上熔融且具有至多20个碳原子并且由至少5wt。 ％的具有最低熔点的聚羧酸和至少10wt。 ％，所述混合物中存在的所有多元羧酸的熔点最高的多元羧酸为至少5重量％ ％。 此外，多元羧酸混合物是低于40℃的固体和高于160℃的液体

公开(公告)号：US20040202864A1

公开(公告)日：2004-10-14

申请号：US10792859

申请日：2004-03-05

Applicant: JAPAN EPOXY RESINS CO., LTD.

Inventor： Yasuyuki Murata ,  Atsuhito Hayakawa ,  Akihiro Itou

IPC: B32B027/38 ,  C08L063/00

CPC classification number: C08G59/04 ,  Y10T428/24264 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/31511

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1null0 in the following general formula (1) and/or components of n2null0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1null0 in the following general formula (1) and/or components of n2null0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation. 1

Abstract translation: 颗粒状环氧树脂通过在常温下粉碎固体的环氧树脂制成，并且由于其熔体粘度低，其中分子量为500以下的组分的总含量为n < 以下通式（1）中的1≤0= 0，和/或以下通式（2）中n 2 = 0的成分为全部环氧树脂的50质量％以上， 以下通式（1）中n 1 = 0的成分中的分子量为400以下的成分和/或下述通式（2）中的n 2 = 0的成分为20质量％ 更多的是整个环氧树脂。 粒状环氧树脂中分子量为200以下的低分子量化合物的含量为0.3质量％以下。 颗粒状环氧树脂容易处理，因为它在储存和运输过程中几乎不会堵塞。

公开(公告)号：US20040186202A1

公开(公告)日：2004-09-23

申请号：US10468532

申请日：2003-12-18

Inventor： Thomas Klettke ,  Karsten Dede

IPC: C08L063/00

CPC classification number: C08L83/06 ,  A61K6/08 ,  C07F5/04 ,  C08G59/306 ,  C08G59/3254 ,  C08L83/14 ,  C09D183/06 ,  C09D183/14

Abstract: The invention relates to polymerizable preparations that contain: (a) 1 to 80% by weight of an epoxide or of a mixture of epoxides of the general formula (I), wherein n and m independently are 1, 2, 3, or 4, and wherein the molar mass of the epoxide or the average molar mass of the mixture of epoxides is 360 to 3000 g/mole, (b) 0 to 80% by weight of an epoxide or of a mixture of epoxides that are different from (a), (c) 3 to 85% by weight of fillers, (d) 0.01 to 25% by weight of initiators, retarders and/or accelerators, (e) 0 to 25% by weight of adjuvants, the percentages relating to the overall weight of the individual preparation.

Abstract translation: 本发明涉及可聚合制剂，其包含：（a）1至80重量％的环氧化物或通式（I）的环氧化物的混合物，其中n和m独立地为1,2,3或4， 并且其中环氧化物的摩尔质量或环氧化物混合物的平均摩尔质量为360至3000g / mol，（b）0至80重量％的环氧化物或环氧化物的混合物，其不同于（a ），（c）3〜85重量％的填料，（d）0.01〜25重量％的引发剂，缓凝剂和/或促进剂，（e）0〜25重量％的助剂， 个体制剂的重量。

公开(公告)号：US20040171763A1

公开(公告)日：2004-09-02

申请号：US10475808

申请日：2004-04-06

Inventor： Albert Arnold Van Geenen ,  Cornelis Eme Koning ,  Remko H. Vreekamp ,  Mathijs Hubert Gertrudes Maassen

IPC: C08G069/26 ,  C08L063/00

CPC classification number: C09J177/06 ,  C09J177/00 ,  C09J177/02 ,  D06N7/0073 ,  D06N7/0076 ,  D06N2203/042 ,  D06N2203/065 ,  D06N2209/06 ,  D06N2209/1628

Abstract: The invention relates to a hot-melt adhesive composition for use in a textile product, in particular a tufted carpet, containing a polymer chosen from the group of polyamides, with a number-average molecular mass of 500-5000 g/mol and functional end groups. This hot-melt adhesive composition can be applied in various forms and results in a good bond of pile material to support material. The invention also relates to a process for the preparation of a textile product, in which the hot-melt adhesive composition is used, and also to the textile product thus obtained and the use thereof as floor or wall covering.

Abstract translation: 本发明涉及一种用于纺织品，特别是簇状地毯的热熔粘合剂组合物，其包含选自数均分子量为500-5000g / mol的聚酰胺的聚合物，并且功能性末端 团体 该热熔粘合剂组合物可以以各种形式施加，并且导致桩材与支撑材料的良好粘结。 本发明还涉及一种用于制备其中使用热熔粘合剂组合物的纺织产品的方法，以及由此获得的纺织品以及其作为地板或墙面覆盖物的用途的方法。

公开(公告)号：US20040102544A1

公开(公告)日：2004-05-27

申请号：US10344944

申请日：2003-05-05

Inventor： John G Woods ,  Susanne D Morrill ,  Jianzhao Wang ,  Brendan J Kneafsley

IPC: C08L063/00

CPC classification number: C07D303/22 ,  C07D303/24 ,  C07D303/44 ,  C08G59/027 ,  C08G59/12 ,  C08G59/18 ,  C08G59/42 ,  C08G59/5026 ,  C09J163/00

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak null-alkoxy ester linkages which provide for the reworkable aspect of the invention.

Abstract translation: 本发明公开了适用于电子部件的包封和底部填充的可再加工的环氧组合物，其包含（a）作为环氧化的1-链烯基醚或1-环烯基醚与多元羧酸的反应产物的可固化环氧组分，反应产物为 基本上不含未反应的酸或酸性杂质; 和（b）环氧组分的固化剂，其中环氧组合物的反应产物是可再加工的。 本发明的固化环氧组合物含有热不稳定的弱α-烷氧基酯键，其提供本发明的可再加工方面。

公开(公告)号：US20040072927A1

公开(公告)日：2004-04-15

申请号：US10269800

申请日：2002-10-14

Inventor： Zakar Raffi Hachikian

IPC: C08L063/00

CPC classification number: C09J5/06 ,  C08G59/18 ,  C08L63/00 ,  C08L2666/02 ,  C09J163/00 ,  C09J2463/00 ,  Y10T428/31511

Abstract: A two-part epoxy adhesive having a resin component containing a mixture of an epoxy resin and an internally flexibilized epoxy resin and a hardener component containing a mixture of a flexibilizer and an unmodified or modified aliphatic amine or combinations thereof. The resin component and hardener component are mixed and applied to substrates, or applied to substrates and mixed, an then allowed to cure yielding a cured epoxy resin having a tensile elongation at room temperature of greater than 30%. The initial curing time is less than 3 hours.

Abstract translation: 具有包含环氧树脂和内部柔性化环氧树脂的混合物的树脂组分和含有增韧剂和未改性或改性脂族胺或其组合的混合物的硬化剂组分的双组分环氧粘合剂。 将树脂组分和固化剂组分混合并施加到基底上，或施加到基底上并混合，然后固化，得到室温下拉伸伸长率的固化环氧树脂大于30％。 初始固化时间小于3小时。

公开(公告)号：US20040048954A1

公开(公告)日：2004-03-11

申请号：US10065012

申请日：2002-09-10

Applicant: BASF CORPORATION

Inventor： Lawrence E. Thieben

IPC: C08L063/00

CPC classification number: C08G59/56 ,  C08L77/00 ,  C09D163/00 ,  C08L2666/20

Abstract: The present invention is a pigmented coating composition, including a film-forming polymer comprising an epoxide polymer. The coating contains a mixture of crosslinking agents wherein at least one crosslinking agent is a polyamide functional compound and at least one crosslinking agent is a phenalkamine compound. The mixture of crosslinking agents is useful in stabilizing the pigment in the coating composition.

Abstract translation: 本发明是着色涂料组合物，包括含有环氧化物聚合物的成膜聚合物。 涂层含有交联剂的混合物，其中至少一种交联剂是聚酰胺官能化合物，至少一种交联剂是苯胺化合物。 交联剂的混合物可用于稳定涂料组合物中的颜料。

公开(公告)号：US20040044101A1

公开(公告)日：2004-03-04

申请号：US10399042

申请日：2003-04-18

Inventor： Yuji Hirose ,  Reiziro Nishida ,  Keiji Inomata ,  Hideo Yokoi ,  Shingo Harada

IPC: C08L063/00

CPC classification number: C09D163/04 ,  C09D133/062 ,  C09D161/06 ,  C08L61/04 ,  C08L2666/04 ,  C08L63/00

Abstract: The present invention provides an aqueous coating composition for the inner surface of a can, comprising a carboxyl-containing, acrylic-modified epoxy resin (C) prepared by reacting a high-molecular-weight epoxy resin (A) that has a number average molecular weight of 3,000 to 30,000 and is a reaction product of a specific low-molecular-weight cresol novolac epoxy resin (a) and a specific low-molecular-weight cresol novolac phenol resin (b), with a carboxyl-containing acrylic resin (B); the carboxyl-containing, acrylic-modified epoxy resin (C) being neutralized and dispersed in an aqueous medium. The aqueous coating composition of the present invention has good application workability and good film performance, and is free from environmental hormone problems caused by bisphenol A.

Abstract translation: 本发明提供了一种用于罐内表面的水性涂料组合物，其包含含羧基的丙烯酸改性环氧树脂（C），其通过使具有数均分子量的高分子量环氧树脂 重量为3000〜30,000，是特定的低分子量甲酚酚醛清漆型环氧树脂（a）与特定的低分子量甲酚酚醛酚醛树脂（b）的反应产物，与含羧基的丙烯酸树脂（B ）; 将含羧基的丙烯酸改性环氧树脂（C）中和并分散在水性介质中。 本发明的水性涂料组合物具有良好的应用可加工性和良好的膜性能，并且不含由双酚A引起的环境激素问题。

公开(公告)号：US20040034126A1

公开(公告)日：2004-02-19

申请号：US10421471

申请日：2003-04-23

Inventor： William E. Garrison ,  James Michael McKenna

IPC: C08L063/00

CPC classification number: C08L67/025 ,  C08K3/38 ,  C08L63/00 ,  C08L67/02 ,  C08L2666/14 ,  C08L2666/22

Abstract: Polymer compositions comprising polyester, boron component, and epoxy component. Articles made from these compositions, particularly articles requiring excellent hydrolysis resistance properties.

Abstract translation: 包含聚酯，硼组分和环氧组分的聚合物组合物。 由这些组合物制成的制品，特别是需要优异耐水解性能的制品。

公开(公告)号：US20040034124A1

公开(公告)日：2004-02-19

申请号：US10296714

申请日：2003-08-21

Inventor： Francois Court ,  Ludwik Leibler ,  Jean-Pierre Pascault ,  Sophie Ritzenthaler

IPC: C08L063/00

CPC classification number: C08L53/00 ,  C08L63/00 ,  C08L2666/14 ,  C08L2666/04 ,  C08L2666/02

Abstract: The present invention relates to a thermoset material with improved impact resistance comprising: 99 to 20% of a thermoset resin, 1 to 80% of an impact modifier comprising at least one copolymer chosen from copolymers comprising S-B-M, B-M and M-B-M blocks, in which: each block is connected to the other by means of a covalent bond or of an intermediate molecule connected to one of the blocks via a covalent bond and to the other block via another covalent bond, M is a PMMA homopolymer or a copolymer comprising at least 50% by weight of m thyl methacrylate, B is incompatible with the thermoset resin and with the M block and its glass transition temperature Tg is less than the operating temperature of the thermoset material, S is incompatible with the thermoset resin, the B block and the M block and its Tg or its melting temperature M.t. is greater than the Tg of B. S is advantageously polystyrene and B polybutadiene. The thermoset resin advantageously originates from the reaction of a thermosetting epoxy resin and of a hardener.

Abstract translation: 本发明涉及具有改进的抗冲击性的热固性材料，其包含：99-20％的热固性树脂，1至80％的抗冲改性剂，其包含至少一种选自包含SBM，BM和MBM嵌段的共聚物的共聚物，其中： 每个嵌段通过共价键或通过共价键连接到其中一个嵌段的中间分子连接，另一个通过另一个共价键连接到另一个嵌段，M是PMMA均聚物或包含至少50个 甲基丙烯酸甲酯的重量百分比，B与热固性树脂和M嵌段不相容，并且其玻璃化转变温度Tg小于热固性材料的操作温度，S与热固性树脂，B嵌段和 M块及其Tg或其熔融温度Mt 大于B B的Tg。有利地，S是聚苯乙烯和B聚丁二烯。 热固性树脂有利地来源于热固性环氧树脂和硬化剂的反应。