公开(公告)号：US20180332702A1

公开(公告)日：2018-11-15

申请号：US15768252

申请日：2016-10-14

申请人： JAPAN SCIENCE AND TECHNOLOGY AGENCY

发明人： Masao NAKAJIMA ,  Ichiro AMIMORI ,  Osamu SAWANOBORI ,  Takao SOMEYA

IPC分类号： H05K1/03 ,  H05K1/11

CPC分类号： H05K1/038 ,  H05K1/0283 ,  H05K1/11 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K3/4046 ,  H05K2201/029 ,  H05K2201/05 ,  H05K2201/10287

摘要： The present invention provides a stress relaxation substrate for relaxing stress generated due to differences in the hardness of a circuit substrate and a cloth body. This stress relaxation substrate is disposed between a cloth body and a circuit board having a wiring, wherein the stress relaxation substrate includes a stress relaxation layer harder than the cloth body, and softer than the circuit board, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive portion provided on the stress relaxation layer to be formed between a first surface and a second surface.