公开(公告)号：US20170306284A1

公开(公告)日：2017-10-26

申请号：US15512618

申请日：2015-09-29

Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY

Inventor： Yoko YAMANISHI ,  Yohei HAMANO ,  Takuya KAMBAYASHI

IPC: C12M1/42 ,  B05B17/06 ,  A61B18/14 ,  A61B18/00

CPC classification number: C12M35/04 ,  A61B18/14 ,  A61B2018/00577 ,  A61B2018/00964 ,  B05B17/0607 ,  C12M35/00 ,  C12M35/02 ,  C12N13/00 ,  C12N15/89

Abstract: The present invention enables fabrication and mass production of a bubble-jetting chip that includes a desired number of bubble jetting portions of the same size having bubble-jetting outlets of the same size.Mass production is enabled by fabricating a bubble-jetting chip comprising a substrate and a bubble-jetting portion formed on the substrate, the bubble-jetting portion comprising: an electrode that is formed of a conductive material; an insulating portion that is formed of an insulating photosensitive resin, is provided so as to sandwich the electrode, and includes an extended section that extends beyond the tip of the electrode; and a space that is formed between the extended section of the insulating portion and the tip of the electrode.