公开(公告)号：US20040182913A1

公开(公告)日：2004-09-23

申请号：US10775395

申请日：2004-02-10

Applicant: JDS Uniphase Corporation ,  JDS Uniphase Inc.

Inventor： Philip Deane ,  Neil Teitelbaum

IPC: B23K031/00

CPC classification number: H05K3/3436 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K3/3494 ,  H05K2201/10484 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

Abstract translation: 将光电二极管或阵列的光电二极管焊接到基板上的方法，即以预定角度倾斜的光电二极管，使用放置在与放置在基板上的对应的一对焊盘相对的光电二极管芯片上的一对焊料凸块。 当光电二极管芯片放置在基板上时，焊料凸起之间，焊料熔化并在焊盘的表面上经过回流焊。 焊盘的形状和焊盘上的焊料凸点的位置使得焊料的表面张力通过将芯片拉到一侧来使芯片倾斜。

公开(公告)号：US20020170943A1

公开(公告)日：2002-11-21

申请号：US10152641

申请日：2002-05-21

Applicant: JDS Uniphase Corporation

Inventor： Philip Deane

IPC: B23K031/02

CPC classification number: H01L24/81 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10484 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of asymmetric solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. This causes the chip to tilt to one side about the axis defined by the asymmetric pads.

Abstract translation: 将光电二极管或阵列的光电二极管焊接到基板上的方法，即以预定角度倾斜的光电二极管使用放置在与放置在基板上的对应的一对不对称焊盘相对的光电二极管芯片上的一对焊料凸块。 当光电二极管芯片放置在基板上时，焊料凸起之间，焊料熔化并在焊盘的表面上经过回流焊。 这使得芯片围绕由不对称焊盘限定的轴线倾斜到一侧。

公开(公告)号：US20040105627A1

公开(公告)日：2004-06-03

申请号：US10713377

申请日：2003-11-14

Applicant: JDS Uniphase Corporation

Inventor： Marian C. Hargis ,  David Peter Gaio ,  Christopher M. Gabel ,  Sundeep Nand Nangalia ,  James Walling ,  Philip Deane ,  William K. Hogan

IPC: G02B006/42

CPC classification number: G02B6/4201 ,  G02B6/4204

Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract translation: 本发明涉及一种用于高速小型收发器的接收机光学子组件（ROSA）。 根据本发明的ROSA包括堆叠式芯片设计，其中安装有光电二极管和跨阻抗放大器的半导体微型工作台垂直于光行进的方向设置。 柔性电连接器连接到半导体微型台架上，用于将ROSA电连接到主机收发器设备。 柔性电连接器固定到半导体微型工作台的表面，其部分切口以接收放大器和从其延伸的其它电气部件。 为了便于组装，从半导体微型工作台蚀刻孔，对应于从用于光耦合器的安装法兰延伸的凸块。