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公开(公告)号：US11134568B2
公开(公告)日：2021-09-28
申请号：US16647119
申请日：2018-09-10
申请人： JSR CORPORATION
摘要： Provided is a high-frequency circuit laminate that can reduce the transmission loss of electrical signals in high-frequency circuits and produce circuit boards with excellent smoothness.
The high-frequency circuit laminate according to the present invention includes a metal layer and a resin layer which are laminated in contact with each other, the resin layer having an elastic modulus from 0.1 to 3 GPa, and the resin layer having an dielectric loss tangent from 0.001 to 0.01 and a relative permittivity from 2 to 3 at a frequency of 10 GHz at 23° C.-
2.发明授权公开(公告)号：US10272426B2
公开(公告)日：2019-04-30
申请号：US15133202
申请日：2016-04-19
申请人： JSR CORPORATION
发明人： Isao Nishimura , Kenji Hoshiko , Masahiro Kaneko
摘要： The present disclosure relates to a method of producing a microfluidic device, a microfluidic device, and a photosensitive resin composition, the method including the steps of: forming a resin layer on a support from a photosensitive resin composition that includes a compound having at least two radical-polymerizable groups, a photoradical generator, a compound having at least two cationically reactive groups, a photocation generator, and at least one compound selected from a protective group-containing amine, a photodegradable base, an imide structure-containing compound, an amide structure-containing compound and an urea structure-containing compound; partially UV-exposing and developing the resin layer; preparing a laminate by placing a cover material on the thus developed resin layer; and UV-exposing the thus obtained laminate.
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公开(公告)号：US11582860B2
公开(公告)日：2023-02-14
申请号：US16647350
申请日：2018-09-10
申请人： JSR CORPORATION
摘要： The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).
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公开(公告)号：US11516906B2
公开(公告)日：2022-11-29
申请号：US16647350
申请日：2018-09-10
申请人： JSR CORPORATION
摘要： The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).
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