公开(公告)号：US11134568B2

公开(公告)日：2021-09-28

申请号：US16647119

申请日：2018-09-10

申请人： JSR CORPORATION

发明人： Isao Nishimura ,  Nobuyuki Miyaki ,  Toshiaki Kadota ,  Shintarou Fujitomi ,  Tomotaka Shinoda

IPC分类号： H05K1/11 ,  B32B15/08 ,  H05K1/02 ,  H05K1/03

摘要： Provided is a high-frequency circuit laminate that can reduce the transmission loss of electrical signals in high-frequency circuits and produce circuit boards with excellent smoothness.
The high-frequency circuit laminate according to the present invention includes a metal layer and a resin layer which are laminated in contact with each other, the resin layer having an elastic modulus from 0.1 to 3 GPa, and the resin layer having an dielectric loss tangent from 0.001 to 0.01 and a relative permittivity from 2 to 3 at a frequency of 10 GHz at 23° C.

公开(公告)号：US11516906B2

公开(公告)日：2022-11-29

申请号：US16647350

申请日：2018-09-10

申请人： JSR CORPORATION

发明人： Isao Nishimura ,  Nobuyuki Miyaki ,  Toshiaki Kadota ,  Shintarou Fujitomi ,  Tomotaka Shinoda

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K1/11

摘要： The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).

公开(公告)号：US10304694B2

公开(公告)日：2019-05-28

申请号：US15608176

申请日：2017-05-30

申请人： JSR CORPORATION

发明人： Takahiro Hayama ,  Yasutaka Kamei ,  Naoki Nishiguchi ,  Satoshi Kamo ,  Tomotaka Shinoda

IPC分类号： H01L21/321 ,  H01L21/306 ,  B24B37/04 ,  B24B49/16

摘要： A semiconductor treatment composition includes potassium, sodium, and a compound A represented by the formula (1), and has a potassium content MK (ppm) and a sodium content MNa (ppm) that satisfy MK/MNa=1×10−1 to 1×104.

公开(公告)号：US20130323587A1

公开(公告)日：2013-12-05

申请号：US13905636

申请日：2013-05-30

申请人： JSR CORPORATION

发明人： Osamu KOSE ,  Yasuo Matsuki ,  Tomotaka Shinoda

IPC分类号： H01M4/62

CPC分类号： H01M4/622 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C08L79/08 ,  H01M4/386 ,  H01M4/483 ,  H01M10/0525

摘要： A binder composition for an electrode of an electric storage device is provided. The binder composition comprises (A) at least one polymer selected from the group consisting of polyamic acids and imidized polymers thereof having an imidization rate of 50% or less and (B) water. The ratio Ma/Mb of the content of the polymer (A), Ma (parts by mass), to the content of the water (B), Mb (parts by mass), ranges from 500 to 5,000. The binder composition for an electrode of the present invention provides an electric storage device having a large charge/discharge capacity and a low degree of capacity degradation due to repetition of a charge/discharge cycle.

摘要翻译： 提供了一种用于蓄电装置的电极的粘合剂组合物。 粘合剂组合物包含（A）至少一种选自酰亚胺化率为50％以下的聚酰胺酸和酰亚胺化聚合物的聚合物，（B）水。 聚合物（A），Ma（质量份）的含量与水（B）的含量，Mb（质量份）的比值Ma / Mb为500〜5000。 本发明的电极用粘结剂组合物提供了由于充电/放电循环的重复而具有大的充电/放电容量和低容量劣化的蓄电装置。

公开(公告)号：US11582860B2

公开(公告)日：2023-02-14

申请号：US16647350

申请日：2018-09-10

申请人： JSR CORPORATION

发明人： Isao Nishimura ,  Nobuyuki Miyaki ,  Toshiaki Kadota ,  Shintarou Fujitomi ,  Tomotaka Shinoda

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K1/11

摘要： The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).

公开(公告)号：US20170330763A1

公开(公告)日：2017-11-16

申请号：US15584168

申请日：2017-05-02

申请人： JSR Corporation

发明人： Yasutaka Kamei ,  Takahiro Hayama ,  Naoki Nishiguchi ,  Satoshi Kamo ,  Tomotaka Shinoda

IPC分类号： H01L21/321 ,  H01L21/302 ,  H01L21/02 ,  H01L21/306 ,  H01L21/304

CPC分类号： H01L21/3212 ,  B24B1/00 ,  B24B37/044 ,  C09G1/00 ,  C09G1/02 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1454 ,  C09K3/1463 ,  C09K13/06 ,  C11D3/14 ,  C11D7/20 ,  C11D11/0047 ,  H01L21/02074 ,  H01L21/30625

摘要： A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 3×101 to 1.5×103 per mL.

公开(公告)号：US10319605B2

公开(公告)日：2019-06-11

申请号：US15584168

申请日：2017-05-02

申请人： JSR Corporation

发明人： Yasutaka Kamei ,  Takahiro Hayama ,  Naoki Nishiguchi ,  Satoshi Kamo ,  Tomotaka Shinoda

IPC分类号： H01L21/321 ,  C09G1/04 ,  C09G1/00 ,  C09G1/06 ,  C09K13/06 ,  C09G1/02 ,  C09K3/14 ,  B24B1/00 ,  B24B37/04 ,  H01L21/306 ,  H01L21/02 ,  C11D3/14 ,  C11D7/20 ,  C11D11/00

摘要： A semiconductor treatment composition includes particles having a particle size of 0.1 to 0.3 micrometers in a number of 3×101 to 1.5×103 per mL.

公开(公告)号：US10199651B2

公开(公告)日：2019-02-05

申请号：US13905636

申请日：2013-05-30

申请人： JSR CORPORATION

发明人： Osamu Kose ,  Yasuo Matsuki ,  Tomotaka Shinoda

IPC分类号： H01M4/62 ,  H01M4/38 ,  C08G73/10 ,  C08L79/08 ,  H01M4/48 ,  H01M10/0525

摘要： A binder composition for an electrode of an electric storage device is provided. The binder composition comprises (A) at least one polymer selected from the group consisting of polyamic acids and imidized polymers thereof having an imidization rate of 50% or less and (B) water. The ratio Ma/Mb of the content of the polymer (A), Ma (parts by mass), to the content of the water (B), Mb (parts by mass), ranges from 500 to 5,000. The binder composition for an electrode of the present invention provides an electric storage device having a large charge/discharge capacity and a low degree of capacity degradation due to repetition of a charge/discharge cycle.