PATTERN-FORMING METHOD
    1.
    发明申请

    公开(公告)号:US20170184960A1

    公开(公告)日:2017-06-29

    申请号:US15460503

    申请日:2017-03-16

    Abstract: A pattern-forming method includes applying a radiation-sensitive composition on a substrate to provide a film on the substrate. The film is exposed. The film exposed is developed. The radiation-sensitive composition includes a metal-containing component that is a metal compound having a hydrolyzable group, a hydrolysis product of the metal compound having a hydrolyzable group, a hydrolytic condensation product of the metal compound having a hydrolyzable group, or a combination thereof. A content of a transition metal atom in the metal-containing component with respect to total metal atoms in the metal-containing component is no less than 50 atomic %.

    PATTERN-FORMING METHOD
    2.
    发明申请

    公开(公告)号:US20180017864A9

    公开(公告)日:2018-01-18

    申请号:US15460503

    申请日:2017-03-16

    Abstract: A pattern-forming method includes applying a radiation-sensitive composition on a substrate to provide a film on the substrate. The film is exposed. The film exposed is developed. The radiation-sensitive composition includes a metal-containing component that is a metal compound having a hydrolyzable group, a hydrolysis product of the metal compound having a hydrolyzable group, a hydrolytic condensation product of the metal compound having a hydrolyzable group, or a combination thereof. A content of a transition metal atom in the metal-containing component with respect to total metal atoms in the metal-containing component is no less than 50 atomic %.

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