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公开(公告)号:US20130252533A1
公开(公告)日:2013-09-26
申请号:US13720830
申请日:2012-12-19
IPC分类号: F24F3/16
CPC分类号: F24F3/161 , B05B17/0638 , B41J29/393 , F24F3/14 , H01L51/0005 , H01L51/56 , H05B33/02 , H05B33/10
摘要: The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.