Painless and patchless shooting microstructure

    公开(公告)号:US10737081B2

    公开(公告)日:2020-08-11

    申请号:US15028007

    申请日:2014-06-17

    Applicant: JUVIC INC.

    Abstract: The present invention relates to a painless and patchless shooting microstructure, and a microstructure shooting device. According to the present invention, it is possible to inject a microstructure into the skin within the time of less than one second, and the inconvenience of waiting for the decomposition of a microstructure and removing a patch are completely overcome. A patch-type conventional technology has a problem wherein it is difficult to be applied to a region having hair, but the present invention completely overcomes this problem. According to the present invention, it is possible to precisely control the permeation depth of a microstructure into the skin by controlling discharge power.

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