公开(公告)号：US20090056866A1

公开(公告)日：2009-03-05

申请号：US12132051

申请日：2008-06-03

申请人： Jae Seok HWANG ,  Sung Kwon HWANGBO

发明人： Jae Seok HWANG ,  Sung Kwon HWANGBO

IPC分类号： B32B38/10 ,  B32B37/00

CPC分类号： B32B37/0046 ,  B32B37/1018 ,  B32B37/12 ,  B32B38/1858 ,  B32B2038/1891 ,  B32B2310/0463 ,  B32B2310/0831 ,  B32B2457/202 ,  Y10T156/15

摘要： A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.

摘要翻译： 一种基板接合装置，包括：第一室，其包括容纳有第一基板的第一表面板，用于提升第一表面板的表面板升降板;第二室，包括第二表面板，待接合的第二基板 接收第一基板，包括在第一表面板中的至少一个粘合剂以粘附到第一基板，以及用于独立地提升粘合剂的粘合提升件。