公开(公告)号：US08184453B1

公开(公告)日：2012-05-22

申请号：US12183979

申请日：2008-07-31

申请人： Jae Yoon Kim ,  Gi Jeong Kim ,  Myung Soo Moon

发明人： Jae Yoon Kim ,  Gi Jeong Kim ,  Myung Soo Moon

IPC分类号： H05K5/02

CPC分类号： H01L23/49541 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed is a lead frame and a semiconductor device including the same. The lead frame is provided with a die pad, and first, second and third lands sequentially arranged on an outer circumferential edge. The lead frame can separate the first and second lands or the die pad and the first land using a plating layer formed on the lead frame as a mask, instead of using a separate mask by etching after the application of the encapsulant. As a result thereof, a plurality of lands can be formed at low cost, in comparison with a conventional method. Additionally, the first, second and third lands are exposed to the outside through a lower portion of an encapsulant, and can be surface mounted on an external device through the first, second and third lands. A plating layer formed on bottom surfaces of the first, second and third lands of the lead frame and a process for separately plating nickel (Ni)/gold (An), Ni/Pd/Au, or tin (Sn) can be omitted so as to easily surface mount the semiconductor device to the external device.

摘要翻译： 公开了一种引线框架和包括该引线框架的半导体器件。 引线框架设置有管芯焊盘，并且顺序地布置在外周边缘上的第一，第二和第三焊盘。 引线框架可以使用形成在引线框架上的镀层作为掩模来分离第一和第二焊盘或裸片焊盘和第一焊盘，而不是在施加密封剂之后通过蚀刻来使用单独的掩模。 作为其结果，与传统方法相比，可以以低成本形成多个焊盘。 此外，第一，第二和第三焊盘通过密封剂的下部暴露于外部，并且可以通过第一，第二和第三焊盘表面安装在外部设备上。 形成在引线框架的第一，第二和第三焊盘的底面上的镀层以及分别镀镍（Ni）/金（An），​​Ni / Pd / Au或锡（Sn）的工艺可以省略 以便容易地将半导体器件表面安装到外部设备。