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1.发明申请LEAD FRAME, LIGHT EMITTING DIODE HAVING THE LEAD FRAME, AND BACKLIGHT UNIT HAVING THE LIGHT EMITTING DIODE 有权引导框架，带引线框架的发光二极管，以及具有发光二极管的背光单元公开(公告)号：US20100315835A1
公开(公告)日：2010-12-16
申请号：US12828633
申请日：2010-07-01
申请人： Jae-Ho Cho , Sean-Jhin Yoon , Tae-Kwang Kim , Kyung-Nam Kim
发明人： Jae-Ho Cho , Sean-Jhin Yoon , Tae-Kwang Kim , Kyung-Nam Kim
CPC分类号： H01L33/60 , H01L33/46 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.
摘要翻译： LED包括发光芯片，金属构件和壳体。 发光芯片产生光。 发光芯片布置在金属构件上。 壳体与金属构件组合以固定金属构件。 壳体具有露出发光芯片和金属构件的至少一部分的开口部分。 金属构件包括基底金属层，布置在基底金属层上的光反射层和布置在光反射层上并包括金属的保护层。
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2.发明授权Lead frame, light emitting diode having the lead frame, and backlight unit having the light emitting diode 有权引线框架，具有引线框架的发光二极管和具有发光二极管的背光单元公开(公告)号：US08723200B2
公开(公告)日：2014-05-13
申请号：US12828633
申请日：2010-07-01
申请人： Jae-Ho Cho , Sean-Jhin Yoon , Tae-Kwang Kim , Kyung-Nam Kim
发明人： Jae-Ho Cho , Sean-Jhin Yoon , Tae-Kwang Kim , Kyung-Nam Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/46 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.
摘要翻译： LED包括发光芯片，金属构件和壳体。 发光芯片产生光。 发光芯片布置在金属构件上。 壳体与金属构件组合以固定金属构件。 壳体具有露出发光芯片和金属构件的至少一部分的开口部分。 金属构件包括基底金属层，布置在基底金属层上的光反射层和布置在光反射层上并包括金属的保护层。
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3.发明授权Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode 有权具有光反射层的引线框架，具有引线框架的发光二极管和具有该发光二极管的背光单元公开(公告)号：US08288785B2
公开(公告)日：2012-10-16
申请号：US12351480
申请日：2009-01-09
申请人： Jae-Ho Cho , Sean-Jhin Yoon , Tae-Kwang Kim , Kyung-Nam Kim
发明人： Jae-Ho Cho , Sean-Jhin Yoon , Tae-Kwang Kim , Kyung-Nam Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/46 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An LED includes a light-emitting chip, a metal member, and a housing. The light-emitting chip generates light. The light-emitting chip is arranged on the metal member. The housing is combined with the metal member to fix the metal member. The housing has an opening portion exposing at least a portion of the light-emitting chip and the metal member. The metal member includes a base metal layer, a light-reflecting layer arranged on the base metal layer, and a protection layer arranged on the light-reflecting layer and including a metal.
摘要翻译： LED包括发光芯片，金属构件和壳体。 发光芯片产生光。 发光芯片布置在金属构件上。 壳体与金属构件组合以固定金属构件。 壳体具有露出发光芯片和金属构件的至少一部分的开口部分。 金属构件包括基底金属层，布置在基底金属层上的光反射层和布置在光反射层上并包括金属的保护层。
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