公开(公告)号：US07372074B2

公开(公告)日：2008-05-13

申请号：US11247700

申请日：2005-10-11

申请人： James C. Milne ,  Leonard J. McNally

发明人： James C. Milne ,  Leonard J. McNally

IPC分类号： H01L29/04 ,  H01L31/036 ,  H01L23/02 ,  H01L23/12 ,  H01L23/06

CPC分类号： B81B3/001 ,  B81C2201/115 ,  B81C2203/036

摘要： An apparatus and method for a silicon-based Micro-Electro Mechanical System (MEMS) device, including a pair of silicon cover structures each having a substantially smooth and planar contact surface formed thereon; a silicon mechanism structure having a part thereof that is movably suspended relative to a relatively stationary frame portion thereof, the frame portion being formed with substantially parallel and spaced-apart smooth and planar contact surfaces; a relatively rough surface disposed between the contact surfaces of the covers and corresponding surfaces of the movable part of the mechanism structure; and wherein the contact surfaces of the cover structures form silicon fusion bond joints with the respective contact surfaces of the mechanism frame.

摘要翻译： 一种硅基微电子机械系统（MEMS）器件的装置和方法，包括一对硅覆盖结构，每个硅覆盖结构具有形成在其上的基本平滑且平坦的接触表面; 硅机构结构，其一部分相对于其相对固定的框架部分可移动地悬挂，所述框架部分形成有大致平行且间隔开的平滑和平坦的接触表面; 布置在所述盖的接触表面和所述机构结构的可移动部分的对应表面之间的相对粗糙的表面; 并且其中所述覆盖结构的接触表面与所述机构框架的相应接触表面形成硅熔合接合点。