公开(公告)号：US06841747B2

公开(公告)日：2005-01-11

申请号：US10252636

申请日：2002-09-23

Applicant: James Derksen ,  Patrick Mo

Inventor： James Derksen ,  Patrick Mo

IPC: H05K7/14 ,  H01H9/06

CPC classification number: H05K7/1432

Abstract: Broadly, there is disclosed in accordance with a first aspect of the invention a reversible housing base for a motor controller having controllable switches of selectable size and bus bars having size selected according to switch size. The reversible housing base comprises a front wall, a rear wall and opposite side walls. The side walls are connected to the front and rear walls in a rectangular configuration to surround the switches and to define a top surface and an opposite bottom surface. The front and rear wall top surface each has a set of slots of a first size to support a first size of bus bars and the front and rear wall bottom surface each has a set of slots of a second size to support a second size of bus bars. The orientation of the housing base is reversible according to size of the bus bars.

Abstract translation: 广泛地，根据本发明的第一方面公开了一种用于电机控制器的可逆壳体底座，其具有可选尺寸的可控开关和具有根据开关尺寸选择的尺寸的母线。 可逆的壳体基座包括前壁，后壁和相对的侧壁。 侧壁以矩形构造连接到前壁和后壁，以围绕开关并且限定顶表面和相对的底表面。 前后壁顶表面各自具有一组第一尺寸的狭槽以支撑第一尺寸的汇流条，并且前壁和后壁底表面各自具有一组第二尺寸的狭槽以支撑第二尺寸的总线 酒吧。 根据母线的尺寸，外壳基座的方向是可逆的。

公开(公告)号：US06891725B2

公开(公告)日：2005-05-10

申请号：US10252643

申请日：2002-09-23

Applicant: James Derksen

Inventor： James Derksen

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/209

Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.

Abstract translation: 模块化电机控制器系列包括壳体。 从多个开关尺寸中的一个中选择固态开关，用于控制期望的电压和电流范围。 开关安装在外壳中，用于连接AC线路和电机端子，用于控制对电机的交流电源的应用。 逻辑电路板安装在壳体中，包括逻辑电路，用于独立于所选择的开关尺寸命令固态开关的操作。 从多个配置之一中选择的接口电路板安装在壳体中，并且包括连接在逻辑电路和固态开关之间的接口电路。 选择接口电路以根据期望的电压和电流范围与所选择的开关尺寸接口。

公开(公告)号：US06900562B2

公开(公告)日：2005-05-31

申请号：US10819326

申请日：2004-04-06

Applicant: James Derksen

Inventor： James Derksen

IPC: H05K7/14 ,  H02K11/00

CPC classification number: H05K7/209

Abstract: A modular motor controller family comprises a housing. Solid state switches are selected from one of plural switch sizes for controlling a desired voltage and current range. The switches are mounted in the housing for connection between an AC line and motor terminals for controlling application of AC power to the motor. A logic circuit board is mounted in the housing including logic circuitry for commanding operation of the solid state switches independent of the selected switch size. An interface circuit board selected from one of plural configurations is mounted in the housing and includes interface circuitry connected between the logic circuitry and the solid state switches. The interface circuitry is selected to interface with the selected switch size according to the desired voltage and current range.

Abstract translation: 模块化电机控制器系列包括壳体。 从多个开关尺寸中的一个中选择固态开关，用于控制期望的电压和电流范围。 开关安装在外壳中，用于连接AC线路和电机端子，用于控制对电机的交流电源的应用。 逻辑电路板安装在壳体中，包括逻辑电路，用于独立于所选择的开关尺寸命令固态开关的操作。 从多个配置之一中选择的接口电路板安装在壳体中，并且包括连接在逻辑电路和固态开关之间的接口电路。 选择接口电路以根据期望的电压和电流范围与所选择的开关尺寸接口。

公开(公告)号：US06191053B1

公开(公告)日：2001-02-20

申请号：US09094443

申请日：1998-06-10

Applicant: Jung-Hoon Chun ,  James Derksen ,  Sangjun Han

Inventor： Jung-Hoon Chun ,  James Derksen ,  Sangjun Han

IPC: H01L21312

CPC classification number: H01L21/6715 ,  B05C5/0245 ,  B05C11/08 ,  B05D1/002 ,  B05D1/005 ,  B05D1/265 ,  G03F7/16 ,  G03F7/162

Abstract: An improved method and apparatus for coating semiconductor substrates with organic photoresist polymers by extruding a ribbon of photoresist in a spiral pattern which covers the entire top surface of the wafer. The invention provides a more uniform photoresist layer and is much more efficient than are current methods in the use of expensive photoresist solutions. A wafer is mounted on a chuck, aligned horizontally and oriented upward. An extrusion head is positioned adjacent to the outer edge of the wafer and above the top surface of the wafer with an extrusion slot aligned radially with respect to the wafer. The wafer is rotated and the extrusion head moved radially toward the center of the wafer while photoresist is extruded out the extrusion slot. The rotation rate of the wafer and the radial speed of the extrusion head are controlled so that the tangential velocity of the extrusion head with respect to the rotating wafer is a constant.

Abstract translation: 一种改进的用有机光致抗蚀剂聚合物涂覆半导体衬底的方法和装置，通过以覆盖晶片的整个顶表面的螺旋图案挤出光致抗蚀剂带。 本发明提供了更均匀的光致抗蚀剂层，并且比使用昂贵的光致抗蚀剂溶液中的现有方法更有效。 将晶片安装在卡盘上，水平排列并向上取向。 挤出头定位成与晶片的外边缘相邻并且在晶片的顶表面上方，具有相对于晶片径向排列的挤压槽。 晶片旋转，并且挤出头朝向晶片的中心径向移动，而光致抗蚀剂被挤出挤出槽。 控制晶片的旋转速度和挤压头的径向速度，使得挤出头相对于旋转晶片的切向速度是恒定的。