公开(公告)号：US5971527A

公开(公告)日：1999-10-26

申请号：US741422

申请日：1996-10-29

申请人： Eric Peeters ,  James F. O'Neill ,  Joel Alan Kubby ,  R. Enrique Viturro ,  Constance J. Thornton ,  David Allen Mantell

发明人： Eric Peeters ,  James F. O'Neill ,  Joel Alan Kubby ,  R. Enrique Viturro ,  Constance J. Thornton ,  David Allen Mantell

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16 ,  H01L21/306 ,  B41J2/19

CPC分类号： B41J2/1632 ,  B41J2/14032 ,  B41J2/14129 ,  B41J2/1604 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

摘要： An ink jet channel wafer for an ink jet printer has a first surface in which a plurality of anisotropically etched ink channels and an anisotropically etched ink reservoir are directly connected to one another. The ink jet channel wafer is etched using an admixture of at least one alkali metal hydroxide and at least one alcohol compound.

摘要翻译： 用于喷墨打印机的喷墨通道晶片具有第一表面，其中多个各向异性蚀刻的墨通道和各向异性蚀刻的墨储存器彼此直接连接。 使用至少一种碱金属氢氧化物和至少一种醇化合物的混合物来蚀刻喷墨通道晶片。

公开(公告)号：US5716533A

公开(公告)日：1998-02-10

申请号：US805834

申请日：1997-03-03

申请人： James F. O'Neill ,  Eric Peeters

发明人： James F. O'Neill ,  Eric Peeters

IPC分类号： B41J2/16 ,  H01L21/00 ,  B44C1/22

CPC分类号： B41J2/1635 ,  B41J2/1604 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631

摘要： A method of fabricating ink jet printheads from channel plates with a low stress integral ink inlet filters and heater plates. The channel plates are obtained from p-type (100) silicon wafers, one surface of which has a lightly doped n-type patterned layer in the form of a screen. In the preferred embodiment, a first etch resistant material is deposited on both surfaces of the wafer and patterned on the surface of wafer opposite the one containing the n-type layer. The patterned first etch resistant material provides a first etch mask with channel and reservoir vias. A second etch resistant material is deposited over the first etch resistant material and patterned on the same wafer surface as the first etch resistant material in order to provide a second etch mask having reservoir vias smaller than the reservoir vias in the first etch mask, but aligned therewithin. The wafer with the two patterned etch masks is placed into an anisotropic etch bath and etched with a bias potential between the p-n junction formed by the patterned n-type layer and the p-type wafer and an electrode also in the etch bath. The patterned, lightly doped, n-type layer functions as an etch stop when under a bias potential, and because the doping level of the n-type layer is low, the internal stress is also low. When the reservoir recesses have been etched through the wafer leaving the patterned n-type layer covering the open bottom, the second etch resistant material is removed and the wafer replaced into the anisotropic etch bath to etch the channel recesses and complete the reservoir recesses with a similar bias potential. The first etch resistant material is removed and the channel wafer is aligned and bonded to a heater wafer. The bonded wafer pair is separated into a plurality of printheads having an integral inlet filter devoid of internal stress.

摘要翻译： 从具有低应力整体式墨水入口过滤器和加热器板的通道板制造喷墨打印头的方法。 通道板从p型（100）硅晶片获得，其一个表面具有屏幕形式的轻掺杂的n型图案化层。 在优选实施例中，第一耐蚀刻材料沉积在晶片的两个表面上并在与包含n型层的晶片相对的晶片表面上图案化。 图案化的第一耐蚀刻材料提供具有通道和储存器通孔的第一蚀刻掩模。 第二耐蚀刻材料沉积在第一耐蚀刻材料上并且在与第一耐蚀刻材料相同的晶片表面上图案化，以便提供具有小于第一蚀刻掩模中的储存器通孔的储存器通孔的第二蚀刻掩模，但是对准 在其中。 将具有两个图案化蚀刻掩模的晶片放置在各向异性蚀刻槽中，并且在由图案化的n型层形成的p-n结与p型晶片之间以及也在蚀刻槽中的电极之间用偏置电位进行蚀刻。 图案化，轻掺杂的n型层在偏置电位下用作蚀刻停止，并且由于n型层的掺杂水平低，因此内部应力也较低。 当储存凹槽已被蚀刻通过晶片留下图案化的n型层覆盖开口底部时，去除第二耐蚀刻材料并将晶片替换成各向异性蚀刻槽以蚀刻通道凹槽并用一个 类似的偏置电位。 去除第一耐蚀刻材料并且将通道晶片对准并结合到加热器晶片。 接合晶片对被分离成具有不具有内部应力的整体入口过滤器的多个打印头。

公开(公告)号：US5867192A

公开(公告)日：1999-02-02

申请号：US805876

申请日：1997-03-03

申请人： David A. Mantell ,  Eric Peeters ,  James F. O'Neill

发明人： David A. Mantell ,  Eric Peeters ,  James F. O'Neill

IPC分类号： B41J2/14 ,  B41J2/05

CPC分类号： B41J2/1628 ,  B41J2/1404 ,  B41J2/1604 ,  B41J2/1629 ,  B41J2002/14379

摘要： In an ink-jet printhead, channels in which liquid ink is nucleated by a heating element defines five sides in cross-section. One of the sides is created by the main surface of a heater chip which includes the heating element, while the other four sides, forming a truncated parallelogram or diamond-shape, are defined in a channel plate abutting the heater chip. The four-sided channel in the channel plate is created by a combined process of plasma etching and wet etching.

摘要翻译： 在喷墨打印头中，液体墨水被加热元件成核的通道限定了五个横截面。 其中一侧由包括加热元件的加热器芯片的主表面产生，而形成截头平行四边形或菱形的其他四个侧面被限定在邻近加热器芯片的通道板中。 通道板中的四面通道是通过等离子体蚀刻和湿蚀刻的组合工艺产生的。

公开(公告)号：US5731827A

公开(公告)日：1998-03-24

申请号：US539890

申请日：1995-10-06

申请人： David A. Mantell ,  Thomas A. Tellier ,  Gary A. Kneezel ,  Steven J. Harrington ,  James F. O'Neill ,  Narayan V. Deshpande ,  Peter A. Torpey

发明人： David A. Mantell ,  Thomas A. Tellier ,  Gary A. Kneezel ,  Steven J. Harrington ,  James F. O'Neill ,  Narayan V. Deshpande ,  Peter A. Torpey

IPC分类号： B41J2/01 ,  B41J2/05 ,  B41J2/13 ,  B41J2/14 ,  B41J2/145 ,  B41J2/15 ,  B41J29/38

CPC分类号： B41J2/04505 ,  B41J2/0458 ,  B41J2/14129 ,  B41J2002/14379 ,  B41J2002/14475

摘要： A liquid ink printing apparatus printing images includes a printhead having a plurality of nozzles wherein a single power pulse causes two or more nozzles to eject ink simultaneously. The printhead includes an ink directing element having a plurality of ink conduits coupled to an array of spaced nozzles and a transducer element aligned with and mated to the ink directing element. The transducers are spaced a distance apart and each transducer is substantially aligned with at least two or more of the nozzles. The printhead is stepped in a direction transverse to the array of spaced nozzles a stepping distance approximately equal to or less than the distance between transducers. The ink directing element includes a silicon wafer having etched ink conduits or channels holding ink for ejection through the nozzles connected thereto. Each transducer is cooperatively associated with one channel having a fork member coupled to two or more nozzles or is cooperatively associated with two or more channels wherein each channel is connected to one or more nozzles.

摘要翻译： 打印图像的液体油墨印刷设备包括具有多个喷嘴的打印头，其中单个功率脉冲使得两个或更多个喷嘴同时喷射墨水。 打印头包括具有连接到间隔开的喷嘴阵列的多个墨水管道和与墨水导向元件对准并配合的换能器元件的墨水引导元件。 换能器间隔开一段距离，每个换能器基本上与至少两个或更多个喷嘴对准。 打印头在与间隔开的喷嘴阵列横向的方向上是步进的，该距离大约等于或小于换能器之间的距离。 墨水引导元件包括具有蚀刻的墨水导管或通道的硅晶片，该墨水管道或通道保持用于通过与其连接的喷嘴喷射的墨水。 每个换能器协同地与一个通道相关联，该通道具有联接到两个或更多个喷嘴的叉构件或者与两个或更多个通道协作地关联，其中每个通道连接到一个或多个喷嘴。

公开(公告)号：US5141596A

公开(公告)日：1992-08-25

申请号：US736996

申请日：1991-07-29

申请人： William G. Hawkins ,  James F. O'Neill ,  Donald J. Drake

发明人： William G. Hawkins ,  James F. O'Neill ,  Donald J. Drake

IPC分类号： B41J2/05 ,  B41J2/16 ,  H01L21/306

CPC分类号： H01L21/30608 ,  B41J2/1604 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635

摘要： An integral filter is fabricated by patterning a layer of etch resistant material on one side of a (100) silicon wafer to produce an array of equally spaced, uniformly sized posts or shapes and doping the exposed surface of the wafer by boron ion implant. The dopant is diffused into the wafer while the array of posts of etch resistant material masks the diffusion under them. The size of the posts or shapes determines the undoped areas of the wafer and, thus, the mesh size of the eventually produced integral filter. The wafer is recoated with a layer of etch resistant material and the other side, which was not doped, is patterned to form a plurality of sets of elongated channel vias and reservoir vias, one reservoir via for each set of channel vias. The wafer is orientation dependently etched for a predetermined time period to produce the sets of channel grooves and reservoir recesses, the recesses having a depth of about 75-85% of the wafer thickness, followed by etching of the wafer in an EDP etchant to finish etching the reservoirs through the wafer. The doped silicon area is not etched, so that an integral filter is produced having an arbitrary pore size determined by the size of the posts or shapes patterned initially prior to the diffused doping step.

摘要翻译： 通过在（100）硅晶片的一侧上图案化耐蚀刻材料层来制造整体滤光器，以产生等间距均匀尺寸的柱或形状的阵列，并通过硼离子注入掺杂晶片的暴露表面。 掺杂剂扩散到晶片中，而抗蚀刻材料的阵列阵列掩盖其下的扩散。 柱或形状的尺寸决定了晶片的未掺杂区域，因此决定了最终产生的积分过滤器的网孔尺寸。 用一层耐蚀刻材料重新涂覆晶片，并且未掺杂的另一侧被图案化以形成多组细长通道通孔和储存器通孔，用于每组通道通孔的一个储存器通孔。 晶片取向依赖地蚀刻预定时间段以产生沟槽和储存器凹槽的组，凹槽具有晶片厚度的约75-85％的深度，随后在EDP蚀刻剂中蚀刻晶片以完成 蚀刻储存器通过晶片。 掺杂的硅区域不被蚀刻，从而产生具有由扩散掺杂步骤之前最初形成图案的柱或尺寸确定的任意孔径的整体过滤器。

公开(公告)号：US4951063A

公开(公告)日：1990-08-21

申请号：US354941

申请日：1989-05-22

申请人： William G. Hawkins ,  Olaf Muller ,  James F. O'Neill

发明人： William G. Hawkins ,  Olaf Muller ,  James F. O'Neill

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16 ,  G01D15/18

CPC分类号： B41J2/14129 ,  B41J2/1604 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642

摘要： A thermal ink jet printhead is improved by a specific heating element structure and method of manufacture. The heating elements each have a resistive layer, a high temperature deposited plasma or pyrolytic silicon nitride thereover of predetermined thickness to electrically isolate a subsequently formed cavitational stress protecting layer of tantalum thereon. The pyrolytic silicon nitride permits wet chemical or dry plasma etching delineation of the tantalum without deleterious impact on the silicon nitride, while the delineated tantalum can serve as mask for the wet etch delineation of the silicon nitride. Because of the high deposition temperatures, the aluminum electrodes are patterned and passivated last. Such a construction lowers the manufacturing cost and concurrently provides a more durable printhead.

摘要翻译： 通过特定的加热元件结构和制造方法来改进热喷墨打印头。 加热元件各自具有预定厚度的电阻层，高温沉积等离子体或热解氮化硅，以电隔离随后形成的钽的空穴应力保护层。 热解氮化硅允许钽的湿化学或干等离子体蚀刻描绘，而对氮化硅没有有害影响，而描绘的钽可以用作氮化硅的湿蚀刻描绘的掩模。 由于沉积温度高，铝电极最后被图案化和钝化。 这种结构降低了制造成本，同时提供了更耐用的打印头。

公开(公告)号：US5870123A

公开(公告)日：1999-02-09

申请号：US679977

申请日：1996-07-15

申请人： Robert V. Lorenze, Jr. ,  James F. O'Neill

发明人： Robert V. Lorenze, Jr. ,  James F. O'Neill

IPC分类号： B41J2/05 ,  B41J2/14 ,  B41J2/16

CPC分类号： B41J2/1623 ,  B41J2/14032 ,  B41J2/1604 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2202/03

摘要： In an ink-jet printhead, the individual channels for ejecting ink onto a print medium are orientation dependently etched along the (111) planes perpendicular to the (110) surface orientation of a single crystal silicon wafer. The silicon wafer is bonded on a glass substrate to act as both a support and an etch stop in the etching process. The orientation of the channels within the silicon layer facilitates channels which are rectangular in cross section.

摘要翻译： 在喷墨打印头中，用于将墨喷射到打印介质上的各个通道沿着垂直于单晶硅晶片的（110）表面取向的（111）面依次蚀刻。 将硅晶片结合在玻璃基板上，以在蚀刻工艺中同时作为支撑和蚀刻停止。 硅层内通道的取向有利于横截面呈矩形的通道。

公开(公告)号：US5277755A

公开(公告)日：1994-01-11

申请号：US803886

申请日：1991-12-09

申请人： James F. O'Neill

发明人： James F. O'Neill

IPC分类号： B41J2/135 ,  B41J2/16 ,  H01L21/306 ,  H01L21/00

CPC分类号： B41J2/1629 ,  B41J2/1604 ,  B41J2/1631

摘要： Three dimensional silicon structures are fabricated from (100) silicon wafers by a single side, two-step anisotropic etching process using different etchants. The two etch masks are formed one on top of the other on a single side of the wafer prior to the initiation of the two-step etching process, with the mask for the largest and deepest etched recesses formed last and used first. The last formed mask is removed to expose the first formed mask. The anisotropic etchant for the smaller, closer toleranced recesses is chosen to minimize mask etching and improve dimensional control of etched recesses requiring close tolerances and uniform sizes.

摘要翻译： 三维硅结构由（100）硅晶片通过单面，使用不同蚀刻剂的两步各向异性蚀刻工艺制造。 在开始两步蚀刻工艺之前，两个蚀刻掩模在晶片的单侧上一个形成在另一个之上，最后形成最大和最深蚀刻的凹槽的掩模，并首先使用。 去除最后形成的掩模以露出第一形成的掩模。 选择较小的，更接近公差的凹槽的各向异性蚀刻剂以使掩模蚀刻最小化，并改善需要紧密公差和均匀尺寸的蚀刻凹槽的尺寸控制。

公开(公告)号：US5204690A

公开(公告)日：1993-04-20

申请号：US724297

申请日：1991-07-01

申请人： Robert V. Lorenze, Jr. ,  James F. O'Neill

发明人： Robert V. Lorenze, Jr. ,  James F. O'Neill

IPC分类号： B41J2/05 ,  B41J2/16

CPC分类号： B41J2/1628 ,  B41J2/1604 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2002/14403

摘要： An ink jet printhead having an integral silicon filter over the printhead ink inlet is disclosed. The filter is produced by orientation dependent etching during printhead fabrication. The individual printheads are obtained by a sectioning operation which cuts aligned and bonded channel and heater wafers into a plurality of printheads. The channel wafer is orientation dependent etched from one side of a (100) silicon wafer through a patterned etch resistant mask layer to produce the plurality of reservoir recesses, each having a predetermined depth and floor thickness, and a plurailty of sets of parallel ink channel grooves, one set of channel grooves for each reservoir recess. The etch resistant mask layer on both sides of the channel wafer are removed and a second etch resistant mask layer is deposited thereon. The second mask layer on the side opposite the one with the channel grooves and reservoir recesses are patterned to produce a plurality of patterns of filter pore vias in alignment with the bottoms of the reservoir recesses. The printhead filters are produced by a second orientation dependent etching step of the channel wafer and prior to bonding to the heater wafer.

摘要翻译： 公开了一种在打印头墨水入口上具有整体硅过滤器的喷墨打印头。 在打印头制造过程中，通过取向相关的蚀刻产生过滤器。 单个打印头通过切割操作获得，切割操作将对准和粘合的通道和加热器晶片切割成多个打印头。 通道晶片从（100）硅晶片的一侧通过图案化的抗蚀刻掩模层取向取向，以产生多个储存器凹槽，每个具有预定的深度和底部厚度，以及多组平行的墨水通道 槽，用于每个储存器凹槽的一组通道槽。 去除沟道晶片两侧的耐蚀刻掩模层，并在其上沉积第二耐蚀刻掩模层。 在与通道槽和储存器凹槽相反的一侧的一侧上的第二掩模层被图案化以产生与储存器凹部的底部对准的多个过滤孔孔的图案。 打印头过滤器通过通道晶片的第二取向相关蚀刻步骤，并且在结合到加热器晶片之前产生。

公开(公告)号：US5131978A

公开(公告)日：1992-07-21

申请号：US534467

申请日：1990-06-07

申请人： James F. O'Neill

发明人： James F. O'Neill

IPC分类号： B41J2/135 ,  B41J2/16 ,  B81B1/00 ,  B81C1/00 ,  H01L21/308

CPC分类号： B41J2/1629 ,  B41J2/1604 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1642 ,  H01L21/3085

摘要： A fabrication process for wafer derived elements such as channel plates for thermal ink jet printers includes formation of a final etchant pattern in first and second masking layers. The second masking layer is a protective layer to prevent removal of the first layer upon removal of a subsequent third masking layer. Preferably, the second masking layer is an oxide applied under low temperature condition to lessen the possibility of inducing formation of oxygen precipitates in the wafer. A third masking layer is formed over the final etchant pattern formed by the first and second masking layers. The third masking layer is patterned to form a precursor structure of a large structure contained in the final etchant pattern. After formation of the precursor structure, the third masking layer is removed and the wafer is subjected to a final etching exposure to form the final etched structures. The process is useful for forming channel plates for thermal ink jet printheads.

摘要翻译： 用于晶片衍生元件（例如热喷墨打印机的通道板）的制造方法包括在第一和第二掩模层中形成最终的蚀刻剂图案。 第二掩模层是在去除随后的第三掩模层时防止去除第一层的保护层。 优选地，第二掩模层是在低温条件下施加的氧化物，以减少在晶片中引起氧析出物的形成的可能性。 在由第一和第二掩模层形成的最终蚀刻剂图案上形成第三掩模层。 图案化第三掩模层以形成包含在最终蚀刻剂图案中的大结构的前体结构。 在形成前体结构之后，去除第三掩模层，并对晶片进行最后的蚀刻曝光以形成最终的蚀刻结构。 该方法对于形成用于热喷墨打印头的通道板是有用的。