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1.发明授权Thin film device for an ink jet printhead and process for the manufacturing same 失效用于喷墨打印头的薄膜装置及其制造方法
公开(公告)号：US4809428A
公开(公告)日：1989-03-07
申请号：US131620
申请日：1987-12-10
申请人： James S. Aden , Jeffrey A. Kahn
发明人： James S. Aden , Jeffrey A. Kahn
CPC分类号： B41J2/14129 , H01C17/075 , H01L49/02 , H05B3/148 , Y10T29/49082 , Y10T29/49083 , Y10T29/49099 , Y10T29/49124
摘要： A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. These strips are formed using a first series of masking and etching steps of define an "X" dimension of a resistive heater element. Then, the conductive strips and resistive material therebetween are completely masked in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer and thereby define a "Y" dimension of the resistive heater element. These steps leave smooth contours, good step coverage and high quality bevelled edges of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer, barrier layer and orifice plate deposition processes to complete a thin film printhead for use in an ink jet printer.
摘要翻译： 一种用于制造薄膜电阻器基底的方法，例如可用于制造喷墨打印头，其中不连续的导电材料条首先在电阻层的表面上被图案化。 使用限定电阻加热器元件的“X”尺寸的第一系列掩模和蚀刻步骤来形成这些条带。 然后，其间的导电带和电阻材料被完全掩蔽，以准备用于去除电阻层的暴露部分的随后的第二蚀刻步骤，从而限定电阻加热器元件的“Y”尺寸。 这些步骤使得如此定义的导电层和电阻层的平滑轮廓，良好的阶梯覆盖和高质量的斜切边缘。 这些层现在已准备好用于随后的钝化层，阻挡层和孔板沉积工艺以完成用于喷墨打印机的薄膜打印头。
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2.发明授权Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining 失效利用化学微加工制造热喷墨打印头中的墨水填充槽
公开(公告)号：US5441593A
公开(公告)日：1995-08-15
申请号：US323185
申请日：1994-10-14
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634
摘要： An ink fill slot can be precisely manufactured in a substrate utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots are appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead by means of an extended portion that results in a reduced shelf length and thus reduced fluid impedance imparted to the ink. The extended portion is precisely etched to controllably align it with other elements of the printhead.
摘要翻译： 可以使用利用化学蚀刻，等离子体蚀刻或其组合的光刻技术在衬底中精确地制造填墨槽。 这些方法可以与激光烧蚀，机械磨蚀或机电加工结合使用以去除所需区域中的附加基材。 墨水填充槽适当地构造成通过延伸部分提供打印头操作频率越来越高的必要体积的墨水，从而减少了搁架长度，从而降低了赋予墨水的流体阻抗。 延伸部分被精确地蚀刻以可控制地将其与打印头的其它元件对准。
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公开(公告)号：US5608436A
公开(公告)日：1997-03-04
申请号：US323187
申请日：1994-10-14
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634
摘要： A printhead for an inkjet printer employs an ink fill slot having an extended portion disposed as a depression on the primary surface of the printhead substrate. The barrier layer of the printhead forms the walls of the ink ejection chambers, the walls of and constrictions in the ink fill channels, and the contoured barrier lobes between the ink fill channels. The extended portion of the ink fill slot follows the contour of the barrier lobes such that the length of the substrate shelf between the ink fill channel constriction and the extended portion of the ink fill slot is equalized between ink ejection chambers.
摘要翻译： 用于喷墨打印机的打印头采用墨水填充槽，其具有在打印头基板的主表面上设置为凹陷的延伸部分。 打印头的阻挡层形成墨水喷射室的壁，墨水填充通道中的壁和收缩部分以及墨水填充通道之间的轮廓的阻挡波瓣。 墨水填充槽的延伸部分遵循阻挡波瓣的轮廓，使得墨水填充通道收缩部之间的基板搁架和墨水填充槽的延伸部分之间的长度在喷墨室之间相等。
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4.发明授权
公开(公告)号：US5387314A
公开(公告)日：1995-02-07
申请号：US9151
申请日：1993-01-25
CPC分类号： B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1634
摘要： An ink fill slot can be precisely manufactured in a substrate utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots are appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead by means of an extended portion that results in a reduced shelf length and thus reduced fluid impedance imparted to the ink. The extended portion is precisely etched to controllably align it with other elements of the printhead.
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