摘要:
Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antenna resonating elements, parasitic antenna resonating elements, and antenna ground structures. The antenna structures may include metal traces that are wrapped around an elongated plastic carrier. The plastic carrier may have metal traces that are coupled to a metal bracket using solder that protrudes through a hole in the metal bracket. A printed circuit board may be mounted between the metal bracket and a metal housing. The metal housing may have a protruding ridge portion that is gripped between prongs on the metal bracket. A cover may cover the metal traces on the elongated plastic carrier. The antenna structures may be mounted between hinge structures that couple upper and lower housing structures. The antenna structures may be configured to operate with comparable performance when the upper and lower housing structures are open and closed.
摘要:
Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antenna resonating elements, parasitic antenna resonating elements, and antenna ground structures. The antenna structures may include metal traces that are wrapped around an elongated plastic carrier. The plastic carrier may have metal traces that are coupled to a metal bracket using solder that protrudes through a hole in the metal bracket. A printed circuit board may be mounted between the metal bracket and a metal housing. The metal housing may have a protruding ridge portion that is gripped between prongs on the metal bracket. A cover may cover the metal traces on the elongated plastic carrier. The antenna structures may be mounted between hinge structures that couple upper and lower housing structures. The antenna structures may be configured to operate with comparable performance when the upper and lower housing structures are open and closed.
摘要:
Electronic devices may be provided with antenna structures such as distributed loop antenna resonating element structures. A distributed loop antenna may be formed on an elongated dielectric carrier and may have a longitudinal axis. The distributed loop antenna may include a loop antenna resonating element formed from a sheet of conductive material that extends around the longitudinal axis. A gap may be formed in the sheet of conductive material. The loop antenna resonating element may be directly fed or indirectly fed. In indirect feeding arrangements, an antenna feed structure for indirectly feeding the loop antenna resonating element may be formed from a directly fed loop antenna structure on the elongated dielectric carrier.
摘要:
Electronic devices may be provided with antenna structures such as distributed loop antenna resonating element structures. A distributed loop antenna may be formed on an elongated dielectric carrier and may have a longitudinal axis. The distributed loop antenna may include a loop antenna resonating element formed from a sheet of conductive material that extends around the longitudinal axis. A gap may be formed in the sheet of conductive material. The gap may be located under an opaque masking layer on the underside of a display cover glass associated with a display. The loop antenna resonating element may have a main body portion that includes the gap and may have an extended tail portion that extends between the display and conductive housing structures. The main body portion and extended tail portion may be configured to ensure that undesired waveguide modes are cut off during operation of the loop antenna.
摘要:
Electronic devices may be provided with antenna structures and antenna isolation element structures. An antenna array may be located within an electronic device. The antenna array may have multiple antennas and interposed antenna isolation element structures for isolating the antennas from each other. An antenna isolation element structure may have a dielectric carrier with a longitudinal axis. A sheet of conductive material may extend around the longitudinal axis to form a conductive loop structure. The loop structure in the antenna isolation element may have a gap that spans the sheet of conductive material parallel to the longitudinal axis. Electronic components may bridge the gap. Control circuitry may adjust the electronic components to tune the antenna isolation element.
摘要:
Electronic devices may be provided with antenna structures such as distributed loop antenna resonating element structures. A distributed loop antenna may be formed on an elongated dielectric carrier and may have a longitudinal axis. The distributed loop antenna may include a loop antenna resonating element formed from a sheet of conductive material that extends around the longitudinal axis. A gap may be formed in the sheet of conductive material. The gap may be located under an opaque masking layer on the underside of a display cover glass associated with a display. The loop antenna resonating element may have a main body portion that includes the gap and may have an extended tail portion that extends between the display and conductive housing structures. The main body portion and extended tail portion may be configured to ensure that undesired waveguide modes are cut off during operation of the loop antenna.
摘要:
Electronic devices may be provided with antenna structures such as distributed loop antenna resonating element structures. A distributed loop antenna may be formed on an elongated dielectric carrier and may have a longitudinal axis. The distributed loop antenna may include a loop antenna resonating element formed from a sheet of conductive material that extends around the longitudinal axis. A gap may be formed in the sheet of conductive material. The loop antenna resonating element may be directly fed or indirectly fed. In indirect feeding arrangements, an antenna feed structure for indirectly feeding the loop antenna resonating element may be formed from a directly fed loop antenna structure on the elongated dielectric carrier.
摘要:
Electronic devices may be provided with antenna structures and antenna isolation element structures. An antenna array may be located within an electronic device. The antenna array may have multiple antennas and interposed antenna isolation element structures for isolating the antennas from each other. An antenna isolation element structure may have a dielectric carrier with a longitudinal axis. A sheet of conductive material may extend around the longitudinal axis to form a conductive loop structure. The loop structure in the antenna isolation element may have a gap that spans the sheet of conductive material parallel to the longitudinal axis. Electronic components may bridge the gap. Control circuitry may adjust the electronic components to tune the antenna isolation element.
摘要:
Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas.
摘要:
Electronic devices may be provided with antenna structures. The antenna structures may include an antenna support structure covered with patterned antenna traces. An antenna support structure may be mounted in an electronic device so that a surface of the antenna support structure that is covered with patterned antenna traces lies flush with a planar surface of the electronic device housing. A display cover layer or other planar structure may be attached to the surface of the antenna support structure and the planar surface of the housing adhesive. Injection molding and extrusion techniques may be used in forming a support structure with elongated parallel cavities. An injection molding tool may have a mold core supported by a support structure at one end, supporting engagement features at the ends of mating mold core structures, or support pins. Molded interconnect devices may be soldered to laser direct structuring components to form antennas.