公开(公告)号：US20080110746A1

公开(公告)日：2008-05-15

申请号：US11595658

申请日：2006-11-09

申请人： Janine K. Kardokus ,  Werner Hort ,  Susan D. Strothers ,  Christie J. Hausman ,  Kevin T. Hubert ,  Diana Morales ,  Michael D. Payton

发明人： Janine K. Kardokus ,  Werner Hort ,  Susan D. Strothers ,  Christie J. Hausman ,  Kevin T. Hubert ,  Diana Morales ,  Michael D. Payton

IPC分类号： C23C14/00

CPC分类号： C23C14/3414

摘要： Sputtering targets having reduced burn-in times are described herein that include: a) a machine-finished surface material having an average grain size, and b) a core material having an average grain size, wherein the machine-finished surface material has an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Sputtering targets having reduced burn-in times are described herein that include: a surface material, and a core material, wherein at least one of the surface material or the core material comprises a relatively band-free crystallographic orientation. In addition, methods of producing sputtering targets having reduced burn-in times include: providing a surface material having at least some residual surface damage, providing a core material, coupling the surface material to the core material, and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material. Also, methods of producing sputtering targets having reduced burn-in times include: providing a surface material combined with a core material, wherein the surface material has at least some residual surface damage and machine-finishing the surface material to an average surface roughness (Ra) equal to or less than about the average grain size of at least one of the surface material or the core material.

摘要翻译： 本文描述了具有减少的老化时间的溅射靶，其包括：a）具有平均晶粒尺寸的机加工的表面材料，以及b）具有平均晶粒尺寸的芯材，其中机加工表面材料具有平均 表面粗糙度（Ra）等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 本文描述了具有减少的老化时间的溅射靶，其包括：表面材料和芯材料，其中至少一个表面材料或芯材料包含相对无带的结晶取向。 此外，生产具有减少的老化时间的溅射靶的方法包括：提供具有至少一些残余表面损伤的表面材料，提供芯材料，将表面材料耦合到芯材料，以及将表面材料机加工成 平均表面粗糙度（Ra）等于或小于表面材料或芯材中至少一种的平均晶粒尺寸。 此外，生产具有减少的烧成时间的溅射靶的方法包括：提供与芯材组合的表面材料，其中表面材料具有至少一些残余表面损伤并将表面材料机加工成平均表面粗糙度（Ra ）等于或小于表面材料或芯材料中的至少一种的平均晶粒尺寸。

公开(公告)号：US09279178B2

公开(公告)日：2016-03-08

申请号：US12109816

申请日：2008-04-25

申请人： Janine K. Kardokus ,  Michael Pinter ,  Michael D. Payton ,  Steven (Chi Tse) Wu ,  Jared Akins ,  Werner Hort

发明人： Janine K. Kardokus ,  Michael Pinter ,  Michael D. Payton ,  Steven (Chi Tse) Wu ,  Jared Akins ,  Werner Hort

IPC分类号： C22F1/00 ,  C23C14/34 ,  C22F1/18

CPC分类号： C23C14/3414 ,  C22F1/18

摘要： Sputtering targets having a reduced burn-in time are disclosed that comprise: a) a heat-modified surface material having a substantially uniform crystallographic orientation, wherein at least part of the surface material was melted during heat-treatment, and b) a core material having an average grain size. Sputtering targets are also disclosed that include a heat-modified surface material having network of shallow trenches, alternating rounded peaks and valleys in the surface of the target or a combination thereof, wherein at least part of the surface material was melted during heat-treatment, and a core material having an average grain size. Methods of producing sputtering targets having reduced burn-in times comprises: a) providing a sputtering target comprising a sputtering surface having a sputter material and a crystal lattice, and b) heat-modifying the sputtering surface in order to melt at least part of the surface material and modify the crystal lattice. Methods of producing a sputtering target having a reduced burn-in time are also disclosed comprising: providing a sputtering target having a sputtering surface, wherein the sputtering surface comprises a damage layer, and modifying the sputtering surface by deplating a layer of material, pulsed-plating a layer of material or a combination thereof.

摘要翻译： 公开了具有减少的老化时间的溅射靶，其包括：a）具有基本上均匀的结晶取向的热改性表面材料，其中至少部分表面材料在热处理期间熔化，以及b）芯材料 具有平均粒度。 还公开了溅射靶，其包括在靶的表面中具有浅沟槽，交替的圆形峰和谷的热改性表面材料或其组合，其中至少部分表面材料在热处理期间熔化， 和具有平均粒径的芯材。 制造具有减少的烧结时间的溅射靶的方法包括：a）提供溅射靶，其包括具有溅射材料和晶格的溅射表面，以及b）对所述溅射表面进行加热改性以熔化至少部分 表面材料并修饰晶格。 还公开了具有降低的烧成时间的溅射靶的制造方法，包括：提供具有溅射表面的溅射靶，其中所述溅射表面包括损伤层，并且通过将材料层去掉， 电镀一层材料或其组合。