Vapor deposition method
    1.
    发明授权

    公开(公告)号:US11910694B2

    公开(公告)日:2024-02-20

    申请号:US17200917

    申请日:2021-03-15

    Inventor: Shigeki Terada

    CPC classification number: H10K71/166 C23C14/042 C23C14/24 H10K71/00 H10K71/164

    Abstract: A vapor deposition method for depositing evaporated materials on a substrate using a mask includes arranging a mask frame and correcting a deflection of the mask frame in the direction of gravity after the mask frame is placed. The mask frame faces the substrate so that a first side is higher than a second side in a direction of gravity. The mask frame is provided with a mask and has the first side and the second side facing each other.

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