公开(公告)号：US20050191003A1

公开(公告)日：2005-09-01

申请号：US10787806

申请日：2004-02-26

申请人： Jason Yorks ,  William Dean ,  Bob Arnold ,  Blake Mynatt

发明人： Jason Yorks ,  William Dean ,  Bob Arnold ,  Blake Mynatt

IPC分类号： G02B6/12 ,  G02B6/42

CPC分类号： G02B6/4201

摘要： A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

摘要翻译： 公开了一种光纤模块，其包括安装在印刷电路或其他安装板的顶表面上的封装集成电路芯片。 集成电路芯片电耦合到沿着印刷电路板的边缘安装并能够发射或接收平行于印刷电路板行进的光的光学子组件（OSA）。 封装的IC芯片通过延伸穿过板的至少一个微波电极和形成在板的相对底表面上的导电迹线电耦合到OSA。

公开(公告)号：US07181099B2

公开(公告)日：2007-02-20

申请号：US10787806

申请日：2004-02-26

申请人： Jason Yorks ,  William Kit Dean ,  Bob Arnold ,  Blake Mynatt

发明人： Jason Yorks ,  William Kit Dean ,  Bob Arnold ,  Blake Mynatt

IPC分类号： G02B6/12 ,  G02B6/26

CPC分类号： G02B6/4201

摘要： A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

摘要翻译： 公开了一种光纤模块，其包括安装在印刷电路或其他安装板的顶表面上的封装集成电路芯片。 集成电路芯片电耦合到沿着印刷电路板的边缘安装并能够发射或接收平行于印刷电路板行进的光的光学子组件（OSA）。 封装的IC芯片通过延伸穿过板的至少一个微波电极和形成在板的相对底表面上的导电迹线电耦合到OSA。