Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
    1.
    发明授权
    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration 有权
    用于集成电路和光学组件集成的光纤模块封装架构

    公开(公告)号:US07181099B2

    公开(公告)日:2007-02-20

    申请号:US10787806

    申请日:2004-02-26

    IPC分类号: G02B6/12 G02B6/26

    CPC分类号: G02B6/4201

    摘要: A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

    摘要翻译: 公开了一种光纤模块,其包括安装在印刷电路或其他安装板的顶表面上的封装集成电路芯片。 集成电路芯片电耦合到沿着印刷电路板的边缘安装并能够发射或接收平行于印刷电路板行进的光的光学子组件(OSA)。 封装的IC芯片通过延伸穿过板的至少一个微波电极和形成在板的相对底表面上的导电迹线电耦合到OSA。

    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
    4.
    发明申请
    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration 有权
    用于集成电路和光学组件集成的光纤模块封装架构

    公开(公告)号:US20050191003A1

    公开(公告)日:2005-09-01

    申请号:US10787806

    申请日:2004-02-26

    IPC分类号: G02B6/12 G02B6/42

    CPC分类号: G02B6/4201

    摘要: A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

    摘要翻译: 公开了一种光纤模块,其包括安装在印刷电路或其他安装板的顶表面上的封装集成电路芯片。 集成电路芯片电耦合到沿着印刷电路板的边缘安装并能够发射或接收平行于印刷电路板行进的光的光学子组件(OSA)。 封装的IC芯片通过延伸穿过板的至少一个微波电极和形成在板的相对底表面上的导电迹线电耦合到OSA。