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    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
    1.
    发明申请
    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration 有权
    用于集成电路和光学组件集成的光纤模块封装架构

    公开(公告)号：US20050191003A1

    公开(公告)日：2005-09-01

    申请号：US10787806

    申请日：2004-02-26

    申请人： Jason Yorks ,  William Dean ,  Bob Arnold ,  Blake Mynatt

    发明人： Jason Yorks ,  William Dean ,  Bob Arnold ,  Blake Mynatt

    IPC分类号： G02B6/12 ,  G02B6/42

    CPC分类号： G02B6/4201

    摘要： A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

    摘要翻译： 公开了一种光纤模块，其包括安装在印刷电路或其他安装板的顶表面上的封装集成电路芯片。 集成电路芯片电耦合到沿着印刷电路板的边缘安装并能够发射或接收平行于印刷电路板行进的光的光学子组件（OSA）。 封装的IC芯片通过延伸穿过板的至少一个微波电极和形成在板的相对底表面上的导电迹线电耦合到OSA。

    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration
    2.
    发明授权
    Fiber optic module packaging architecture for integrated circuit and optical subassembly integration 有权
    用于集成电路和光学组件集成的光纤模块封装架构

    公开(公告)号：US07181099B2

    公开(公告)日：2007-02-20

    申请号：US10787806

    申请日：2004-02-26

    申请人： Jason Yorks ,  William Kit Dean ,  Bob Arnold ,  Blake Mynatt

    发明人： Jason Yorks ,  William Kit Dean ,  Bob Arnold ,  Blake Mynatt

    IPC分类号： G02B6/12 ,  G02B6/26

    CPC分类号： G02B6/4201

    摘要： A fiber optic module that includes a packaged integrated circuit chip mounted on a top surface of a printed circuit or other mounting board is disclosed. The integrated circuit chip is electrically coupled to an optical subassembly (OSA) mounted along an edge of the printed circuit board and capable of emitting or receiving light traveling parallel to the printed circuit board. The packaged IC chip is electrically coupled to the OSA through at least one microwave via extending through the board and a conductive trace formed on the opposed bottom surface of the board.

    摘要翻译： 公开了一种光纤模块，其包括安装在印刷电路或其他安装板的顶表面上的封装集成电路芯片。 集成电路芯片电耦合到沿着印刷电路板的边缘安装并能够发射或接收平行于印刷电路板行进的光的光学子组件（OSA）。 封装的IC芯片通过延伸穿过板的至少一个微波电极和形成在板的相对底表面上的导电迹线电耦合到OSA。

    HIGH SPEED OPTICAL SUB-ASSEMBLY WITH CERAMIC CARRIER
    4.
    发明申请
    HIGH SPEED OPTICAL SUB-ASSEMBLY WITH CERAMIC CARRIER 审中-公开
    高速光电子组件与陶瓷载体

    公开(公告)号：US20060162104A1

    公开(公告)日：2006-07-27

    申请号：US11278520

    申请日：2006-04-03

    申请人： Kevin Malone ,  Christine Mollenkopf ,  Jason Yorks ,  Lance Thompson ,  Blake Mynatt ,  Mark Stiehl ,  Tess Abidi ,  William Dean ,  Robert Arnold ,  Richard Adams ,  George Jarriel ,  Dale Isaacson

    发明人： Kevin Malone ,  Christine Mollenkopf ,  Jason Yorks ,  Lance Thompson ,  Blake Mynatt ,  Mark Stiehl ,  Tess Abidi ,  William Dean ,  Robert Arnold ,  Richard Adams ,  George Jarriel ,  Dale Isaacson

    IPC分类号： G11B23/50

    CPC分类号： G02B6/4232 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4292 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02296 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0683 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber. The fiber launch direction is generally orthogonal to the optical surface of the vertically emitting or vertically receiving optical element secured within the ceramic carrier. The optical subassembly comprising the plastic optical housing and ceramic carrier is mounted on the surface of a printed circuit board or adjacent the edge of a printed circuit board, such that the light emitted or detected by the optical element, preferably travels along a fiber launch direction parallel to the surface of the printed circuit board. The optical assembly may be joined to the printed circuit board using various connectors capable of carrying an electrical signal.

    摘要翻译： 用于光学元件的多层陶瓷载体包括用于保持垂直接收或垂直发射的光学元件的梯形腔。 多层陶瓷载体包括介于陶瓷层之间并沿着形成在空腔中的沟槽延伸到梯形腔中的导电迹线。 垂直空腔表面发射激光器或垂直接收光学元件被引线接合到延伸到空腔中的导电迹线。 在一个实施例中，多层陶瓷载体的梯形空腔包括VCSEL和其中的光电检测器，该光电检测器能够监测VCSEL的输出光功率。 形成多层陶瓷载体的方法包括形成多层陶瓷带，连接层，然后共烧烧层叠层。 多层陶瓷载体连接到塑料光学外壳，该外壳包括用于固定光纤的孔。 光纤发射方向通常垂直于固定在陶瓷载体内的垂直发射或垂直接收的光学元件的光学表面。 包括塑料光学壳体和陶瓷载体的光学子组件安装在印刷电路板的表面上或与印刷电路板的边缘相邻，使得由光学元件发射或检测到的光优选沿着光纤发射方向 平行于印刷电路板的表面。 光学组件可以使用能够承载电信号的各种连接器连接到印刷电路板。

    Optical subassembly enclosure
    5.
    发明授权
    Optical subassembly enclosure 失效
    光学组件外壳

    公开(公告)号：US06880986B2

    公开(公告)日：2005-04-19

    申请号：US10813994

    申请日：2004-03-30

    申请人： Blake Mynatt ,  Dennis King ,  Jason Yorks ,  William Kit Dean ,  Mark Stiehl

    发明人： Blake Mynatt ,  Dennis King ,  Jason Yorks ,  William Kit Dean ,  Mark Stiehl

    IPC分类号： G02B6/36 ,  G02B6/42 ,  H05K9/00

    CPC分类号： H05K9/0016 ,  G02B6/4201 ,  G02B6/4251 ,  G02B6/426 ,  G02B6/4277 ,  G02B6/428

    摘要： A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling feature includes a corrugated channel having a cross-sectional area that varies along the longitudinal direction of said channel and the channel retains a gasket having a substantially constant cross-sectional area. The corrugated channel, which receives the gasket, includes varying wide and narrow sections. The sealing feature provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the pieces of the housing.

    摘要翻译： 用于光电器件的多件式外壳的密封特性。 壳体为耦合到保持在壳体内的光电器件的光纤提供EMI屏蔽和轴向污染抑制。 在示例性实施例中，缩放特征包括具有沿着所述通道的纵向方向变化的横截面积的波纹通道，并且通道保持具有基本恒定的横截面面积的垫圈。 接收垫圈的波纹通道包括变化的宽而窄的部分。 密封特征提供了整个垫圈的足够的压缩和在壳体的两块之间形成的紧密的EMI屏蔽密封。

    High speed optical subassembly with ceramic carrier
    7.
    发明授权
    High speed optical subassembly with ceramic carrier 失效
    具有陶瓷载体的高速光学组件

    公开(公告)号：US06888169B2

    公开(公告)日：2005-05-03

    申请号：US09969085

    申请日：2001-10-01

    申请人： Kevin Malone ,  Christine Mollenkopf ,  Jason Yorks ,  Lance Thompson ,  Blake Mynatt ,  Mark Stiehl ,  Tess Abidi ,  William Kit Dean ,  Robert A. Arnold ,  Richard J. Adams ,  George W. Jarriel, Jr. ,  Dale Isaacson

    发明人： Kevin Malone ,  Christine Mollenkopf ,  Jason Yorks ,  Lance Thompson ,  Blake Mynatt ,  Mark Stiehl ,  Tess Abidi ,  William Kit Dean ,  Robert A. Arnold ,  Richard J. Adams ,  George W. Jarriel, Jr. ,  Dale Isaacson

    IPC分类号： G02B6/42 ,  H01L25/16 ,  H01S5/02 ,  H01S5/022 ,  H01S5/062 ,  H01S5/183 ,  H01L31/12

    CPC分类号： G02B6/4232 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4292 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01S5/02248 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02296 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0683 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A multilayer ceramic carrier for an optical element includes a terraced cavity for retaining a vertically receiving or vertically emitting optical element. The multilayer ceramic carrier includes conductive traces interposed between the ceramic layers and which extend into the terraced cavity along the trenches formed in the cavity. A vertical cavity surface emitting laser or vertically receiving optical element is wire bonded to the conductive traces which extend into the cavity. In one embodiment, the terraced cavity of the multilayer ceramic carrier includes a VCSEL and photodetector therein, the photodetector capable of monitoring the output optical power of the VCSEL. The method for forming the multilayer ceramic carrier includes forming a plurality of layers of ceramic tape, joining the layers, then co-firing the stacked layers. The multilayer ceramic carrier is joined to a plastic optical housing which includes an aperture for securing an optical fiber. The fiber launch direction is generally orthogonal to the optical surface of the vertically emitting or vertically receiving optical element secured within the ceramic carrier. The optical subassembly comprising the plastic optical housing and ceramic carrier is mounted on the surface of a printed circuit board or adjacent the edge of a printed circuit board, such that the light emitted or detected by the optical element, preferably travels along a fiber launch direction parallel to the surface of the printed circuit board. The optical assembly may be joined to the printed circuit board using various connectors capable of carrying an electrical signal.

    摘要翻译： 用于光学元件的多层陶瓷载体包括用于保持垂直接收或垂直发射的光学元件的梯形腔。 多层陶瓷载体包括介于陶瓷层之间并沿着形成在空腔中的沟槽延伸到梯形腔中的导电迹线。 垂直空腔表面发射激光器或垂直接收光学元件被引线接合到延伸到空腔中的导电迹线。 在一个实施例中，多层陶瓷载体的梯形空腔包括VCSEL和其中的光电检测器，该光电检测器能够监测VCSEL的输出光功率。 形成多层陶瓷载体的方法包括形成多层陶瓷带，连接层，然后共烧烧层叠层。 多层陶瓷载体连接到塑料光学外壳，该外壳包括用于固定光纤的孔。 光纤发射方向通常垂直于固定在陶瓷载体内的垂直发射或垂直接收的光学元件的光学表面。 包括塑料光学壳体和陶瓷载体的光学子组件安装在印刷电路板的表面上或与印刷电路板的边缘相邻，使得由光学元件发射或检测到的光优选沿着光纤发射方向 平行于印刷电路板的表面。 光学组件可以使用能够承载电信号的各种连接器连接到印刷电路板。

    Optical subassembly enclosure
    8.
    发明授权
    Optical subassembly enclosure 有权
    光学组件外壳

    公开(公告)号：US06755578B1

    公开(公告)日：2004-06-29

    申请号：US10011685

    申请日：2001-12-04

    申请人： Blake Mynatt ,  Dennis King ,  Jason Yorks ,  William Kit Dean ,  Mark Stiehl

    发明人： Blake Mynatt ,  Dennis King ,  Jason Yorks ,  William Kit Dean ,  Mark Stiehl

    IPC分类号： G02B636

    CPC分类号： H05K9/0016 ,  G02B6/4201 ,  G02B6/4251 ,  G02B6/426 ,  G02B6/4277 ,  G02B6/428

    摘要： A housing for optoelectronic devices provides EMI shielding and axial strain suppression for optical fibers coupled to optoelectronic devices retained within the housing. The housing includes an internal septum for EMI shielding and a grounding scheme including relief features of the conductive housing coupled to internal grounding strips. The housing provides a first exemplary engaging/locking feature including an orthogonal tongue and a groove that receives the tongue, and a second exemplary engaging/locking feature that includes a groove having an intermittently varying cross-sectional area and that retains a gasket of constant cross-sectional area. Arms extend from tho housing and retain an optical fiber that is secured to the arm by an adhesive such that axial strain is not exerted at the point of optical coupling and a high optical coupling efficiency is maintained. In an exemplary embodiment, the housing includes an opening through a bottom surface, the opening bounded by beveled edges to aid in blind alignment of the housing over components formed on a mounting surface. The bottom of the housing includes a recessed portion that retains a gasket. The recessed portion receives a gasket of constant thickness and includes a gap of varying thickness that provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the housing and the mounting surface.

    摘要翻译： 用于光电器件的外壳为耦合到保持在外壳内的光电器件的光纤提供EMI屏蔽和轴向应变抑制。 壳体包括用于EMI屏蔽的内部隔膜和包括耦合到内部接地条的导电外壳的释放特征的接地方案。 壳体提供第一示例性的接合/锁定特征，其包括正交的榫舌和容纳舌部的凹槽，以及第二示例性接合/锁定特征，其包括具有间歇变化的横截面积的凹槽，并且保持具有恒定交叉的垫圈 区域。 臂从壳体延伸并保持通过粘合剂固定到臂的光纤，使得在光耦合点处不产生轴向应变，并且保持高的光耦合效率。 在示例性实施例中，壳体包括通过底表面的开口，该开口由斜边缘限定，以帮助壳体与形成在安装表面上的部件的盲对齐。 壳体的底部包括保持垫圈的凹部。 凹陷部分接收一个恒定厚度的垫圈，并且包括一个改变厚度的间隙，其提供整个垫圈的足够的压缩力，以及形成在壳体和安装表面之间的紧密的EMI屏蔽密封件。

    Method for making hermetically sealed transmitter optical subassembly
    9.
    发明授权
    Method for making hermetically sealed transmitter optical subassembly 失效
    制造密封发射机光学组件的方法

    公开(公告)号：US06960032B2

    公开(公告)日：2005-11-01

    申请号：US10812554

    申请日：2004-03-30

    申请人： Joachim Eldring ,  Blake Mynatt ,  Kevin Malone ,  Rich Adams

    发明人： Joachim Eldring ,  Blake Mynatt ,  Kevin Malone ,  Rich Adams

    IPC分类号： G02B6/00 ,  G02B6/30 ,  G02B6/36 ,  H01S5/02 ,  H01S5/022 ,  H01S5/22 ,  H01S5/42

    CPC分类号： H01S5/423 ,  H01S5/0222 ,  H01S5/02284

    摘要： A method for making a transmitter optical subassembly (TOSA) is provided. In the method, an alignment in the Z-direction between a fiber stub array (FSA) and a VCSEL array is performed first. Then, an alignment in the X-Y direction is performed. A rough prealignment in the X-Y direction may also be performed prior to the alignment in Z-direction. A vertical cavity surface emitting laser (VCSEL) array may be hermetically sealed using a lens assembly or by using a separate lid assembly. The hermetic sealing and attaching of different components may be achieved by laser welding and/or soldering or any other suitable method.

    摘要翻译： 提供了一种制造发射机光学组件（TOSA）的方法。 在该方法中，首先执行光纤短截线阵列（FSA）和VCSEL阵列之间的Z方向的对准。 然后，进行X-Y方向的取向。 也可以在Z方向上的对准之前进行X-Y方向的粗略的预对准。 可以使用透镜组件或通过使用单独的盖组件气密地密封垂直空腔表面发射激光器（VCSEL）阵列。 通过激光焊接和/或焊接或任何其它合适的方法可以实现不同部件的气密密封和附接。

    Hermetically sealed transmitter optical subassembly
    10.
    发明授权
    Hermetically sealed transmitter optical subassembly 有权
    密封发射机光学组件

    公开(公告)号：US06757308B1

    公开(公告)日：2004-06-29

    申请号：US10152701

    申请日：2002-05-22

    申请人： Joachim Eldring ,  Blake Mynatt ,  Kevin Malone ,  Rich Adams

    发明人： Joachim Eldring ,  Blake Mynatt ,  Kevin Malone ,  Rich Adams

    IPC分类号： H01S522

    CPC分类号： H01S5/423 ,  H01S5/0222 ,  H01S5/02284

    摘要： During assembly of a transmitter optical subassembly (TOSA), an alignment in Z-direction between a fiber stub array (FSA) and a VCSEL array is performed first, then an alignment in X-Y direction is performed. A rough pre-alignment in X-Y direction may also be performed prior to the alignment in Z-direction. A vertical cavity surface emitting laser (VCSEL) array may be hermetically sealed using a lens assembly or by using a separate lid assembly. The hermetic sealing and attaching of different components may be achieved by laser welding and/or soldering or any other suitable method.

    摘要翻译： 在组装发射机光学子组件（TOSA）期间，首先执行在光纤短截线阵列（FSA）和VCSEL阵列之间的Z方向上的对准，然后执行X-Y方向的对准。 也可以在Z方向上的对准之前进行X-Y方向的粗略的预对准。 可以使用透镜组件或通过使用单独的盖组件气密地密封垂直空腔表面发射激光器（VCSEL）阵列。 通过激光焊接和/或焊接或任何其它合适的方法可以实现不同部件的气密密封和附接。