公开(公告)号：US4247981A

公开(公告)日：1981-02-03

申请号：US49265

申请日：1979-06-18

Applicant: Jay A. Walters

Inventor： Jay A. Walters

IPC: H01R12/58 ,  H05K1/09 ,  H05K3/32 ,  H05K13/04 ,  H05K3/30

CPC classification number: H05K3/321 ,  H01R12/58 ,  H05K1/095 ,  H05K2201/10333 ,  H05K2203/1453 ,  Y10T29/49139 ,  Y10T29/49153

Abstract: Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19)inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film " conductive inks.This divisional application relates particularly to methods of assembling such sockets with printed circuits having flowable, heat-curable conductive pads (14), wherein each socket is first fastened in the mounting hole so that a contact section (13) of the socket compresses the pad, after which the pad is heated to cure the conductive patterns and to bond the contact section of the socket to the pad.

Abstract translation: 互连插座（10）与诸如印刷电路卡（12）的基板组装以将电气部件（18）的引线（17）连接到沉积在基板上的导电焊盘（14）。 每个插座具有插入基板中的安装孔（11）中的端部（19），用于抓住孔的壁部分以将插座安装到板上; 用于接触导电垫的中央部（13）; 以及用于夹持部件引线并通过插座将其连接到焊盘的引线接合部分（16）。 优选地，插座是导电电镀弹簧金属的管状构件，其具有用于弹性地接合孔，接触垫和引线的壁的弹簧构件（20,22,30）。 插座对于热固性导电颗粒/树脂导体，例如银环氧树脂或丙烯酸树脂“厚膜”导电油墨是特别有用的。 该分案申请特别涉及将具有可流动的可热固化的导电焊盘（14）的印刷电路组装这种插座的方法，其中每个插座首先被紧固在安装孔中，使得插座的接触部分（13）压缩垫 之后，焊盘被加热以固化导电图案并将插座的接触部分接合到焊盘。

公开(公告)号：US4181387A

公开(公告)日：1980-01-01

申请号：US917773

申请日：1978-06-21

Applicant: Jay A. Walters

Inventor： Jay A. Walters

IPC: H05K1/12

CPC classification number: H01R12/58 ,  Y10T29/4914

Abstract: Interconnect sockets (10) are assembled with substrates, such as printed circuit cards (12), to connect the leads (17) of electrical components (18) to conductive pads (14) deposited on the substrate. Each socket has an end section (19) inserted into a mounting hole (11) in the substrate, for gripping portions of the walls of the hole to mount the socket to the board; a midsection (13) for contacting the conductive pad; and a lead-engaging section (16) for gripping the component lead and connecting it to the pad through the socket. Preferably, the socket is a tubular member of a conductively plated spring metal, with spring members (20, 22, 30) for resiliently engaging the walls of the hole, the contact pad, and the lead. The sockets are especially useful with thermosetting conductive-particle/resin conductors, such as silver-epoxy or -acrylic resin "thick-film" conductive inks.

Abstract translation: 互连插座（10）与诸如印刷电路卡（12）的基板组装以将电气部件（18）的引线（17）连接到沉积在基板上的导电焊盘（14）。 每个插座具有插入基板中的安装孔（11）中的端部（19），用于抓住孔的壁部分以将插座安装到板上; 用于接触导电垫的中央部（13）; 以及用于夹持部件引线并通过插座将其连接到焊盘的引线接合部分（16）。 优选地，插座是导电电镀弹簧金属的管状构件，其具有用于弹性地接合孔，接触垫和引线的壁的弹簧构件（20,22,30）。 插座对于热固性导电颗粒/树脂导体，例如银环氧树脂或丙烯酸树脂“厚膜”导电油墨是特别有用的。