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35 条记录 (耗时 0.019 秒)

    Semi-conductor die mount assembly
    1.
    发明申请
    Semi-conductor die mount assembly 审中-公开
    半导体模具安装组件

    公开(公告)号：US20060186535A1

    公开(公告)日：2006-08-24

    申请号：US11063916

    申请日：2005-02-23

    申请人： Jay Baker ,  Lawrence Kneisel ,  Prathap Reddy

    发明人： Jay Baker ,  Lawrence Kneisel ,  Prathap Reddy

    IPC分类号： H01L23/34

    CPC分类号： H01L23/49833 ,  H01L23/3677 ,  H01L33/641 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and thermal connection. The die mount includes a first set of pads and a second set of pads. A first pad of the first set of pads is connected to a second pad of the second set of pads through a plurality of vias. The vias comprise an electrically and thermally conductive material that connect the first pad to the second pad through a substrate.

    摘要翻译： 提供了包括半导体管芯和管芯安装件的管芯安装组件。 半导体管芯可以是发光二极管管芯，其附接到形成电和热连接的管芯安装件。 管芯安装件包括第一组焊盘和第二组焊盘。 第一组焊盘的第一焊盘通过多个通孔连接到第二组焊盘的第二焊盘。 通孔包括导电和导热材料，其通过基底将第一焊盘连接到第二焊盘。

    Dielectric thermal stack for the cooling of high power electronics
    2.
    发明申请
    Dielectric thermal stack for the cooling of high power electronics 审中-公开
    用于大功率电子设备冷却的介质热堆

    公开(公告)号：US20050083655A1

    公开(公告)日：2005-04-21

    申请号：US10685931

    申请日：2003-10-15

    申请人： Vivek Jairazbhoy ,  Prathap Reddy ,  Mohan Paruchuri ,  Jay Baker

    发明人： Vivek Jairazbhoy ,  Prathap Reddy ,  Mohan Paruchuri ,  Jay Baker

    IPC分类号： H01L23/373 ,  H01L23/427 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/3733 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014

    摘要： A system for dissipating heat in an electronic power module is provided. The system includes a semiconductor die, a substrate, and a heat sink in which is contained a first fluid, and a conduit through which a second fluid is permitted to flow. The substrate is attached on one surface to the die and configured to conduct heat from the die. The heat sink is attached to another surface of the substrate and transfers heat from the die to the first fluid contained therein, which evaporates due to the heat provided by the substrate. The fluid is condensed on a condensing wall cooled by the second fluid, which flows across the outer surface of the condensing wall, to transport heat away from the heat sink.

    摘要翻译： 提供了一种用于在电子电源模块中散热的系统。 该系统包括半导体管芯，衬底和散热器，其中容纳有第一流体，以及允许第二流体流过的导管。 衬底在一个表面附着到管芯上，并被配置为从管芯传导热量。 散热器附接到基板的另一表面，并将热量从模具传递到其中包含的第一流体，由于由基板提供的热量而蒸发。 流体在由第二流体冷却的冷凝壁上冷凝，第二流体流过冷凝壁的外表面，以将热量从散热器传送出去。

    Underhood electronic interior integration
    3.
    发明授权
    Underhood electronic interior integration 失效
    冥想电子内部整合

    公开(公告)号：US07070229B2

    公开(公告)日：2006-07-04

    申请号：US10371465

    申请日：2003-02-21

    申请人： Andrew Glovatsky ,  Jay Baker ,  Myron Lemecha ,  Lawrence Kneisel

    发明人： Andrew Glovatsky ,  Jay Baker ,  Myron Lemecha ,  Lawrence Kneisel

    IPC分类号： B62D25/08

    CPC分类号： B60R16/0207 ,  B62D25/081

    摘要： An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site to an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the passenger site of the bulkhead for thermal cooling as well as protection from the harsh environment of the engine compartment. The bulkhead has an aperture sized to allow the flatwire bus to pass through the bulkhead into the engine compartment. By utilizing a flatwire bus, this aperture is small in size and the integrity of the bulkhead is improved.

    摘要翻译： 电子系统通常包括扁平电子站点和将扁线电子站点电连接到发动机室中的电子设备的扁平总线。 扁线电子站点具有柔性基板，电子元件附接到基板上用于电子设备的操作。 扁线电子站点安装在舱壁的乘客位置进行热冷却，同时防止发动机舱的恶劣环境。 隔板具有一个孔口，其尺寸允许扁线总线通过舱壁进入发动机舱室。 通过使用扁线总线，该孔径尺寸小，并且提高了隔板的完整性。

    Face shield
    5.
    外观设计
    Face shield 有权

    公开(公告)号：USD928415S1

    公开(公告)日：2021-08-17

    申请号：US29741716

    申请日：2020-07-15

    申请人： Jay Baker

    设计人： Jay Baker

    Electronically integrated vehicle structure
    7.
    发明申请
    Electronically integrated vehicle structure 有权
    电子集成车辆结构

    公开(公告)号：US20050231907A1

    公开(公告)日：2005-10-20

    申请号：US10828396

    申请日：2004-04-20

    申请人： Andrew Glovatsky ,  Jay Baker ,  Richard McMillan ,  Myron Lemecha ,  Daniel Vander Sluis

    发明人： Andrew Glovatsky ,  Jay Baker ,  Richard McMillan ,  Myron Lemecha ,  Daniel Vander Sluis

    IPC分类号： B60R16/02 ,  H05K7/20

    CPC分类号： B60R16/0207

    摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

    摘要翻译： 集成车辆结构包括塑料支撑结构中的电子位置。 该电子站点具有安装在其上的电子部件的柔性基板。 塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。 每个肋具有形成塑料安装表面的一部分的侧边缘。 柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。 也可以提供限定金属安装表面的方法支撑结构。 一个或多个电子侧可以附接到金属和塑料安装表面。

    Method of producing a packaging container with a closure and release mechanism
    8.
    发明授权
    Method of producing a packaging container with a closure and release mechanism 有权

    公开(公告)号：US10308396B2

    公开(公告)日：2019-06-04

    申请号：US15943405

    申请日：2018-04-02

    申请人： Jay Baker ,  Jessup Baker

    发明人： Jay Baker ,  Jessup Baker

    IPC分类号： B29C51/08 ,  B65D25/10 ,  B65D1/34 ,  B65D43/16

    摘要： An apparatus and method for manufacturing a container with a closure-release mechanism. The process in particular relates to thermoforming a plastic sheet to form a container with a clam shell locking system in order to facilitate a secure closure and easy opening packaging container. The clam shell locking arrangement comprises a post which is secured in an aperture when the container is in closed state. The post is a projection or protrusion in a vertical or nearly vertical sidewall of the cover of the thermoformed package and fits securely into the aperture, which is a cut-out made in the outer, and optionally also the inner, wall segments of the vertical or nearly vertical surfaces of the base section of the thermoplastic containers.

    Packaging Container Having a Closure and Release Mechanism
    10.
    发明申请
    Packaging Container Having a Closure and Release Mechanism 审中-公开
    包装容器具有封闭和释放机制

    公开(公告)号：US20150225139A1

    公开(公告)日：2015-08-13

    申请号：US14693270

    申请日：2015-04-22

    申请人： Jay Baker

    发明人： Jay Baker

    IPC分类号： B65D43/22 ,  B65D43/16 ,  B65D25/24 ,  B65D25/04 ,  B65D25/54

    CPC分类号： B65D25/24 ,  B65D21/0219 ,  B65D25/04 ,  B65D25/108 ,  B65D25/22 ,  B65D43/162 ,  B65D2543/00194 ,  B65D2543/00296 ,  B65D2543/00361 ,  B65D2543/00537 ,  B65D2543/00666 ,  B65D2543/00703 ,  B65D2543/00731 ,  B65D2543/00814

    摘要： A packaging container having a closure and release mechanism is provided having a base section and a cover section, with the cover section adapted to cover the base section when in a closed state. The closure and release mechanism includes at least one first aperture formed within an inner wall segment of the base section and at least one second aperture formed within an outer wall segment of the base section, which is aligned with the at least one first aperture. At least one projection extending inwardly from a side wall portion of the cover section is also provided for engaging the at least one first aperture and the at least one second aperture of the base section. Thus, the closure and release mechanism retains the cover section over the base section and secures the packaging container in a closed position. The at least one projection is released from the at least one first aperture and the at least one second aperture by depressing a deformable flange, thereby opening the packaging container.

    摘要翻译： 具有闭合和释放机构的包装容器设置有具有基部和盖部，盖部适于在处于关闭状态时覆盖基部。 闭合和释放机构包括形成在基部的内壁段内的至少一个第一孔和形成在基部的外壁段内的至少一个第二孔，其与至少一个第一孔对准。 还设置有从盖部分的侧壁部分向内延伸的至少一个突起，用于接合基部的至少一个第一孔和至少一个第二孔。 因此，闭合和释放机构将盖部分保持在基部上，并将包装容器固定在关闭位置。 通过按压可变形凸缘，至少一个突起从至少一个第一孔和至少一个第二孔释放，从而打开包装容器。