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    SINGLE-SIDED, FLAT, NO LEAD, INTEGRATED CIRCUIT PACKAGE
    2.
    发明申请
    SINGLE-SIDED, FLAT, NO LEAD, INTEGRATED CIRCUIT PACKAGE 有权
    单面，平面，无引线，集成电路封装

    公开(公告)号：US20080197504A1

    公开(公告)日：2008-08-21

    申请号：US11697260

    申请日：2007-04-05

    申请人： Jeff Alan Gordon ,  Steven Hass ,  Hal Kurkowski ,  Scott Jones

    发明人： Jeff Alan Gordon ,  Steven Hass ,  Hal Kurkowski ,  Scott Jones

    IPC分类号： H01L23/50 ,  H01L21/00

    CPC分类号： H01L24/46 ,  H01L23/32 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/325 ,  H05K2201/10636 ,  H05K2203/168 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

    摘要翻译： 一种集成电路封装，包括包括绝缘壳体，第一电触头和第二电触头的外壳。 绝缘壳体，第一电触点和第二电触头被配置成形成外壳的接触侧。 此外，第一和第二电触头的尺寸被设计成基本对准不对终端用途设备的相应触点进行机电连接的对准。 封装封装集成电路管芯，该集成电路管芯电耦合到第一和第二电触点。 对准不敏感的第一和第二电触点可以电机械连接到最终用途设备（例如打印机）的相应触点。 此外，集成电路封装可以由外围设备（例如，打印机墨盒）托管。

    Single-sided, flat, no lead, integrated circuit package
    3.
    发明授权
    Single-sided, flat, no lead, integrated circuit package 有权
    单面，平面，无引线，集成电路封装

    公开(公告)号：US08338955B2

    公开(公告)日：2012-12-25

    申请号：US11697260

    申请日：2007-04-05

    申请人： Jeff Alan Gordon ,  Steven Hass ,  Hal Kurkowski ,  Scott Jones

    发明人： Jeff Alan Gordon ,  Steven Hass ,  Hal Kurkowski ,  Scott Jones

    IPC分类号： H01L23/48

    CPC分类号： H01L24/46 ,  H01L23/32 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/325 ,  H05K2201/10636 ,  H05K2203/168 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).

    摘要翻译： 一种集成电路封装，包括包括绝缘壳体，第一电触头和第二电触头的外壳。 绝缘壳体，第一电触点和第二电触头被构造成形成外壳的接触侧。 此外，第一和第二电触头的尺寸被设计成基本对准不对终端用途设备的相应触点进行机电连接的对准。 封装封装集成电路管芯，该集成电路管芯电耦合到第一和第二电触点。 对准不敏感的第一和第二电触点可以电机械连接到最终用途设备（例如打印机）的相应触点。 此外，集成电路封装可以由外围设备（例如，打印机墨盒）托管。