Methods of making slotted substrates
    1.
    发明授权
    Methods of making slotted substrates 失效
    制作开槽衬底的方法

    公开(公告)号:US07549224B2

    公开(公告)日:2009-06-23

    申请号:US11450572

    申请日:2006-06-09

    IPC分类号: B23P17/00

    摘要: The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.

    摘要翻译: 所描述的实施例涉及开槽基板和制造开槽基板的方法。 一种示例性方法在位于衬底的第一表面上的第一层中形成第一组虚拟特征,并且在位于第一层上的第二层中对第二组虚拟特征进行图案化。 在所述方法对所述第一组虚拟特征和所述第二组虚拟特征进行图案化之后,所述方法进一步在所述基板中形成槽,所述方法至少部分地通过允许蚀刻剂穿过所述第一和第二组虚拟特征到 第一表面。

    Slotted substrates and methods of making
    2.
    发明授权
    Slotted substrates and methods of making 有权
    开槽底物和制作方法

    公开(公告)号:US07083268B2

    公开(公告)日:2006-08-01

    申请号:US10686231

    申请日:2003-10-15

    IPC分类号: B41J2/05

    摘要: The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.

    摘要翻译: 所描述的实施例涉及开槽基板和制造开槽基板的方法。 一种示例性方法在位于衬底的第一表面上的第一层中形成第一组虚拟特征,并且在位于第一层上的第二层中对第二组虚拟特征进行图案化。 在所述方法对所述第一组虚拟特征和所述第二组虚拟特征进行图案化之后,所述方法进一步在所述基板中形成槽,所述方法至少部分地通过允许蚀刻剂穿过所述第一和第二组虚拟特征到 第一表面。

    Managing contaminants in a fluid-delivery device
    4.
    发明授权
    Managing contaminants in a fluid-delivery device 有权
    管理流体输送装置中的污染物

    公开(公告)号:US07111932B2

    公开(公告)日:2006-09-26

    申请号:US10666753

    申请日:2003-09-18

    IPC分类号: B41J2/19

    摘要: Methods and systems for managing contaminants are described. One exemplary method ejects fluid from multiple ejection chambers of a printing device in a pattern designed primarily to create fluid flow to move a contaminant present in fluid contained in a fluid-feed channel configured to supply fluid to the multiple ejection chambers. Responsive to the ejection, the method moves fluid in the fluid-feed channel sufficiently to move a contaminant in a desired direction within the fluid-feed channel.

    摘要翻译: 描述了用于管理污染物的方法和系统。 一种示例性方法以主要用于产生流体流动的图案将印刷装置的多个喷射室喷射流体,以移动存在于流体供给通道中的流体中的污染物,该流体供给通道被配置为将流体供应到多个喷射室。 响应于喷射,该方法充分地移动流体馈送通道中的流体,以使流体馈送通道内的所需方向上的污染物移动。

    Fluid-ejection device and methods of forming same
    5.
    发明授权
    Fluid-ejection device and methods of forming same 失效
    流体喷射装置及其形成方法

    公开(公告)号:US07334871B2

    公开(公告)日:2008-02-26

    申请号:US10810270

    申请日:2004-03-26

    IPC分类号: B41J2/135 B41J2/09

    CPC分类号: B41J2/14 B41J2/04

    摘要: The described embodiments relate to fluid-ejection devices and methods of forming same. One exemplary embodiment includes a plurality of fluid drop generators and associated electrically conductive paths, and at least one electron beam generation assembly configured to selectively direct at least one electron beam at individual electrically conductive paths sufficiently to cause fluid to be ejected from an associated fluid drop generator.

    摘要翻译: 所描述的实施例涉及流体喷射装置及其形成方法。 一个示例性实施例包括多个流体液滴发生器和相关联的导电路径,以及至少一个电子束产生组件,被配置为在各个导电路径下选择性地引导至少一个电子束,以使流体从相关联的液滴 发电机。