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公开(公告)号：US06938985B2
公开(公告)日：2005-09-06
申请号：US10601150
申请日：2003-06-20
CPC分类号： B41J2/1628 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1629 , B41J2/1634
摘要： The described embodiments relate to a slotted substrate for use in a fluid ejecting device. One embodiment includes a substrate, and a slot received in the substrate. The slot has a central region and one or more terminal region(s). The central region extends at least in part along a pair of sidewalls. Individual terminal region(s) being defined by a terminal sidewall at least a portion of which extends away from both sidewalls of the central region.
摘要翻译： 所描述的实施例涉及用于流体喷射装置的开槽衬底。 一个实施例包括基板和接收在基板中的槽。 槽具有中心区域和一个或多个端子区域。 中心区域沿着一对侧壁至少部分地延伸。 单个端子区域由端子侧壁限定，端子侧壁的至少一部分远离中心区域的两个侧壁延伸。
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公开(公告)号：US07238293B2
公开(公告)日：2007-07-03
申请号：US10601148
申请日：2003-06-20
IPC分类号： B41J2/16
CPC分类号： B41J2/1628 , B41J2/14145 , B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/19
摘要： The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling slot.
摘要翻译： 所描述的实施例涉及开槽衬底及其形成方法。 一种示例性方法在第一衬底表面上形成足以暴露第一表面的第一区域的硬掩模，并且通过少于第一表面的第一区域的整体在衬底中形成狭缝部分。 狭槽部分在第一表面处具有小于第一区域的横截面面积的横截面积。 在形成狭缝部分之后，该方法蚀刻基板以从第一区域内移除材料以形成流体处理槽。
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公开(公告)号：US06648454B1
公开(公告)日：2003-11-18
申请号：US10283767
申请日：2002-10-30
IPC分类号： B41J205
CPC分类号： B41J2/1628 , B41J2/14145 , B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1642 , B41J2/19
摘要： The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling
摘要翻译： 所描述的实施例涉及开槽衬底及其形成方法。 一种示例性方法在第一衬底表面上形成足以暴露第一表面的第一区域的硬掩模，并且通过少于第一表面的第一区域的整体在衬底中形成狭缝部分。 狭槽部分在第一表面处具有小于第一区域的横截面面积的横截面积。 在形成狭缝部分之后，该方法蚀刻基底以从第一区域内移除材料以形成流体处理
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公开(公告)号：US07549224B2
公开(公告)日：2009-06-23
申请号：US11450572
申请日：2006-06-09
IPC分类号： B23P17/00
CPC分类号： B41J2/1628 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1629 , Y10T29/49083 , Y10T29/49401
摘要： The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.
摘要翻译： 所描述的实施例涉及开槽基板和制造开槽基板的方法。 一种示例性方法在位于衬底的第一表面上的第一层中形成第一组虚拟特征，并且在位于第一层上的第二层中对第二组虚拟特征进行图案化。 在所述方法对所述第一组虚拟特征和所述第二组虚拟特征进行图案化之后，所述方法进一步在所述基板中形成槽，所述方法至少部分地通过允许蚀刻剂穿过所述第一和第二组虚拟特征到 第一表面。
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公开(公告)号：US07083268B2
公开(公告)日：2006-08-01
申请号：US10686231
申请日：2003-10-15
IPC分类号： B41J2/05
CPC分类号： B41J2/1628 , B41J2/1404 , B41J2/14145 , B41J2/1603 , B41J2/1629 , Y10T29/49083 , Y10T29/49401
摘要： The described embodiments relate to slotted substrates and methods of making the slotted substrates. One exemplary method patterns a first set of dummy features in a first layer positioned over a first surface of a substrate and patterns a second set of dummy features in a second layer positioned over the first layer. After the method patterns the first set of dummy features and the second set of dummy features, the method further forms a slot in the substrate, at least in part, by allowing an etchant to pass through the first and second sets of dummy features to the first surface.
摘要翻译： 所描述的实施例涉及开槽基板和制造开槽基板的方法。 一种示例性方法在位于衬底的第一表面上的第一层中形成第一组虚拟特征，并且在位于第一层上的第二层中对第二组虚拟特征进行图案化。 在所述方法对所述第一组虚拟特征和所述第二组虚拟特征进行图案化之后，所述方法进一步在所述基板中形成槽，所述方法至少部分地通过允许蚀刻剂穿过所述第一和第二组虚拟特征到 第一表面。
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公开(公告)号：US07105456B2
公开(公告)日：2006-09-12
申请号：US10977090
申请日：2004-10-29
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634
摘要： A method of forming a slot in a substrate comprises growing an oxide layer on a first side of a substrate, patterning and etching the oxide layer to form an opening, forming a material overlying the opening and the oxide layer, removing substrate material through a second side to a first distance from the first side, and anisotropic etching the substrate to create a substrate opening at the first side which is aligned with the opening in the oxide layer during anisotropic etching. The material overlying the opening and the oxide layer is selected so that an anisotropic etch rate of the substrate at an interface of the material and the substrate is greater than an anisotropic etch rate of the substrate at an interface of the oxide layer and the substrate.
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公开(公告)号：US07695104B2
公开(公告)日：2010-04-13
申请号：US11410358
申请日：2006-04-25
IPC分类号： B41J2/135
CPC分类号： B41J2/1631 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1634
摘要： Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a structure contains a plurality of slots in a substrate. The structure also has a trench in the substrate contiguous with the plurality of slots to form a compound slot.
摘要翻译： 描述了在衬底中形成复合槽的方法和系统。 在一个示例性实施例中，结构在衬底中包含多个槽。 该结构还在衬底中具有与多个槽相邻的沟槽，以形成复合槽。
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公开(公告)号：US07376303B2
公开(公告)日：2008-05-20
申请号：US11490388
申请日：2006-07-20
申请人： Chien-Hua Chen , Kuohua Wu , Jeffrey S. Obert
发明人： Chien-Hua Chen , Kuohua Wu , Jeffrey S. Obert
CPC分类号： G02B6/0001
摘要： An optical coupling assembly includes light transmitting or reflecting members fusion bonded to one another.
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公开(公告)号：US20080019653A1
公开(公告)日：2008-01-24
申请号：US11490388
申请日：2006-07-20
申请人： Chien-Hua Chen , Kuohua Wu , Jeffrey S. Obert
发明人： Chien-Hua Chen , Kuohua Wu , Jeffrey S. Obert
CPC分类号： G02B6/0001
摘要： An optical coupling assembly includes light transmitting or reflecting members fusion bonded to one another.
摘要翻译： 光耦合组件包括彼此熔合的光透射或反射构件。
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公开(公告)号：US07040735B2
公开(公告)日：2006-05-09
申请号：US10601157
申请日：2003-06-20
CPC分类号： B41J2/1631 , B41J2/14145 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1634
摘要： Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.
摘要翻译： 描述了在衬底中形成复合槽的方法和系统。 在一个示例性实施方式中，一种方法在衬底中形成多个槽。 该方法还蚀刻与多个狭缝相邻的衬底中的沟槽，以形成复合槽。
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