公开(公告)号：US20060180192A1

公开(公告)日：2006-08-17

申请号：US11058029

申请日：2005-02-14

申请人： Jeffrey Sharp ,  James Bierschenk

发明人： Jeffrey Sharp ,  James Bierschenk

IPC分类号： H01L35/28

CPC分类号： H01L35/32 ,  H01L23/38 ,  H01L35/325 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A thermoelectric module is provided that includes a first thermally conductive plate with a first array of thermoelectric elements coupled to it. The first array of thermoelectric elements includes a first plurality of thermoelectric elements. The thermoelectric module also includes a second thermally conductive plate coupled to the first array of thermoelectric elements, and a second array of thermoelectric elements coupled to the second plate. The second array of thermoelectric elements includes a second plurality of thermoelectric elements. A third thermally conductive plate is coupled to the second array of thermoelectric elements. The thermoelectric module also includes a portion of each thermoelectric element of the first and second pluralities of thermoelectric elements being coplanar with at least a portion of every other thermoelectric element of the first and second pluralities of thermoelectric elements.

摘要翻译： 提供了一种热电模块，其包括具有与其耦合的第一热电元件阵列的第一导热板。 第一热电元件阵列包括第一多个热电元件。 热电模块还包括耦合到第一热电元件阵列的第二导热板和耦合到第二板的第二热电元件阵列。 第二热电元件阵列包括第二多个热电元件。 第三导热板耦合到第二热电元件阵列。 热电模块还包括第一和第二多个热电元件的每个热电元件的一部分与第一和第二多个热电元件的每隔一个热电元件的至少一部分共面。

公开(公告)号：US20060107989A1

公开(公告)日：2006-05-25

申请号：US10998113

申请日：2004-11-24

申请人： James Bierschenk ,  Joshua Moczygemba ,  Tracy Aydelott

发明人： James Bierschenk ,  Joshua Moczygemba ,  Tracy Aydelott

IPC分类号： H01L35/30 ,  H01L35/28

CPC分类号： H01L35/32 ,  H01L35/34

摘要： In accordance with one embodiment of the present invention, a method of manufacturing a thermoelectric device is disclosed. The method includes forming a wafer of thermoelectric material and coupling the wafer to a stiff backing such that a bottom side of the wafer faces the stiff backing and a top side of the wafer faces away from the stiff backing. The method also includes reducing a thickness of the wafer by removing a portion of the wafer from the top side, and dicing the wafer into a plurality of blocks. At least a portion of the plurality of blocks are then coupled with a permanent substrate.

摘要翻译： 根据本发明的一个实施例，公开了一种制造热电装置的方法。 该方法包括形成热电材料晶片并将晶片连接到刚性背衬，使得晶片的底侧面向刚性背衬，并且晶片的顶侧面远离刚性背衬。 该方法还包括通过从顶侧去除晶片的一部分来切割晶片的厚度，并将晶片切割成多个块。 然后，多个块中的至少一部分与永久基片相连。

公开(公告)号：US20060124165A1

公开(公告)日：2006-06-15

申请号：US11008025

申请日：2004-12-09

申请人： James Bierschenk ,  Joshua Moczygemba ,  Tracy Aydelott

发明人： James Bierschenk ,  Joshua Moczygemba ,  Tracy Aydelott

IPC分类号： H01L35/28

CPC分类号： H01L35/32 ,  H01L35/30 ,  H01L35/34

摘要： A thermoelectric device is provided that includes a top plate with surface including a first and second portion. A first plurality of thermoelectric elements are coupled to the first portion, and a second plurality of thermoelectric elements are coupled to the second portion. A base plate is coupled to the first and second plurality of thermoelectric elements. The first and second plurality of thermoelectric elements are operable to transfer thermal energy from the top plate to the base plate when an electrical current is passed through the first and second plurality of thermoelectric elements. The second plurality of thermoelectric elements receives a higher electrical current density than the first plurality of thermoelectric elements, and the second plurality of thermoelectric elements transfer more thermal energy per unit area of the top plate than the first plurality of thermoelectric elements.

摘要翻译： 提供一种热电装置，其包括具有包括第一和第二部分的表面的顶板。 第一多个热电元件耦合到第一部分，并且第二多个热电元件耦合到第二部分。 基板耦合到第一和第二多个热电元件。 当电流通过第一和第二多个热电元件时，第一和第二多个热电元件可操作以将热能从顶板传递到基板。 所述第二多个热电元件接收比所述第一多个热电元件更高的电流密度，并且所述第二多个热电元件比所述第一多个热电元件传递比所述顶板的每单位面积更多的热能。