公开(公告)号：US20110024743A1

公开(公告)日：2011-02-03

申请号：US12648680

申请日：2009-12-29

申请人： Jeong Woo LEE ,  Hyung Dong Lee ,  Jun Gi Choi ,  Sang Hoon Shin ,  Xiang Hua Cui

发明人： Jeong Woo LEE ,  Hyung Dong Lee ,  Jun Gi Choi ,  Sang Hoon Shin ,  Xiang Hua Cui

IPC分类号： H01L23/52

CPC分类号： H01L25/0657 ,  G01R31/2884 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.

摘要翻译： 半导体集成电路包括具有多个半导体芯片的多芯片封装。 半导体集成电路包括信号线; 以及多个半导体芯片中的半导体芯片中的信号负载补偿部，被配置为响应于测试信号的激活而将设计的信号加载到信号线。 这里，设计的信号负载具有与信号线的多个半导体芯片中的另一半导体芯片的信号负载分量相对应的值。

公开(公告)号：US08748888B2

公开(公告)日：2014-06-10

申请号：US12648680

申请日：2009-12-29

申请人： Jeong Woo Lee ,  Hyung Dong Lee ,  Jun Gi Choi ,  Sang Hoon Shin ,  Xiang Hua Cui

发明人： Jeong Woo Lee ,  Hyung Dong Lee ,  Jun Gi Choi ,  Sang Hoon Shin ,  Xiang Hua Cui

IPC分类号： H01L23/58

CPC分类号： H01L25/0657 ,  G01R31/2884 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor integrated circuit includes a multi-chip package having a plurality of semiconductor chips. The semiconductor integrated circuit includes a signal line; and a signal loading compensation section in a semiconductor chip among the plurality of semiconductor chips, configured to apply a designed signal loading to the signal line in response to activation of a test signal. Here, the designed signal loading has a value corresponding to a signal loading component of another semiconductor chip among the plurality of semiconductor chips to the signal line.

摘要翻译： 半导体集成电路包括具有多个半导体芯片的多芯片封装。 半导体集成电路包括信号线; 以及多个半导体芯片中的半导体芯片中的信号负载补偿部，被配置为响应于测试信号的激活而将设计的信号加载到信号线。 这里，设计的信号负载具有与信号线的多个半导体芯片中的另一半导体芯片的信号负载分量相对应的值。

公开(公告)号：US20110156034A1

公开(公告)日：2011-06-30

申请号：US12840231

申请日：2010-07-20

申请人： Xiang Hua Cui ,  Jeong Woo Lee ,  Sang Hoon Shin

发明人： Xiang Hua Cui ,  Jeong Woo Lee ,  Sang Hoon Shin

IPC分类号： H01L23/522 ,  H01L21/66

CPC分类号： G11C29/702

摘要： A repair circuit of a semiconductor apparatus includes a plurality of through-silicon vias including repeated sets of one repair through-silicon via and an M number of normal through-silicon vias; a transmission unit configured to multiplex input data at a first multiplexing rate based on control signals, and transmit the multiplexed data to the plurality of through-silicon vias; a reception unit configured to multiplex signals transmitted through the plurality of through-silicon vias at a second multiplexing rate based on the control signals, and generate output data; and a control signal generation unit configured to generate sets of the control signals based on an input number of a test signal.

摘要翻译： 半导体装置的修复电路包括多个穿硅通孔，包括重复的一组修复通硅通孔和M个通常的硅通孔; 传输单元，被配置为基于控制信号以第一多路复用速率复用输入数据，并将多路复用数据发送到多个通孔通孔; 接收单元，被配置为基于所述控制信号以第二多路复用速率复用通过所述多个穿硅通孔传输的信号，并生成输出数据; 以及控制信号生成单元，被配置为基于测试信号的输入号码生成控制信号的集合。

公开(公告)号：US08514641B2

公开(公告)日：2013-08-20

申请号：US12840231

申请日：2010-07-20

申请人： Xiang Hua Cui ,  Jeong Woo Lee ,  Sang Hoon Shin

发明人： Xiang Hua Cui ,  Jeong Woo Lee ,  Sang Hoon Shin

IPC分类号： G11C7/00

CPC分类号： G11C29/702

摘要： A repair circuit of a semiconductor apparatus includes a plurality of through-silicon vias including repeated sets of one repair through-silicon via and an M number of normal through-silicon vias; a transmission unit configured to multiplex input data at a first multiplexing rate based on control signals, and transmit the multiplexed data to the plurality of through-silicon vias; a reception unit configured to multiplex signals transmitted through the plurality of through-silicon vias at a second multiplexing rate based on the control signals, and generate output data; and a control signal generation unit configured to generate sets of the control signals based on an input number of a test signal.

摘要翻译： 半导体装置的修复电路包括多个穿硅通孔，包括重复的一组修复通硅通孔和M个通常的硅通孔; 传输单元，被配置为基于控制信号以第一多路复用速率复用输入数据，并将多路复用数据发送到多个通孔通孔; 接收单元，被配置为基于所述控制信号以第二多路复用速率复用通过所述多个穿硅通孔传输的信号，并生成输出数据; 以及控制信号生成单元，被配置为基于测试信号的输入号码生成控制信号的集合。