公开(公告)号：US10014276B2

公开(公告)日：2018-07-03

申请号：US14631635

申请日：2015-02-25

申请人： Jia-Chi Samuel Chieh

发明人： Jia-Chi Samuel Chieh

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/66

CPC分类号： H01L24/85 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48135 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/30107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/49 ,  H01L2924/206

摘要： A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.

公开(公告)号：US20160247752A1

公开(公告)日：2016-08-25

申请号：US14631635

申请日：2015-02-25

申请人： Jia-Chi Samuel Chieh

发明人： Jia-Chi Samuel Chieh

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48135 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/30107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/45014 ,  H01L2224/49

摘要： A method for connecting an integrated circuit (IC) to a printed circuit board (PCB) can include the steps of fixing the IC and the PCB to a dielectric substrate. A single wire bond can be used to bond the IC to the PCB, and a ground plane can be established for the PCB. To minimize inductance losses at high frequency operation, a ground plane defect can be intentionally established by forming at least one opening in the ground plane. The opening can be rectangular when viewed in top plan, although the number of openings formed and opening geometry can be chosen according to the desired operating frequency of the device. The defect can allow for single wire bonding of the IC to the PCB in a manner which allows for high frequency operation without requiring the integration of additional matching network components on the IC and PCB.

摘要翻译： 用于将集成电路（IC）连接到印刷电路板（PCB）的方法可以包括将IC和PCB固定到电介质基板的步骤。 可以使用单线接合将IC连接到PCB，并且可以为PCB建立接地平面。 为了最大限度地降低高频操作时的电感损耗，可以通过在接地平面上形成至少一个开口来有意建立接地平面缺陷。 尽管可以根据设备的期望的工作频率来选择形成的开口的数量和开口几何形状，但是当从顶部平面观察时，该开口可以是矩形的。 该缺陷可以允许IC以PCB的单线接合，从而允许高频操作，而不需要在IC和PCB上集成额外的匹配网络组件。