公开(公告)号：US20200184177A1

公开(公告)日：2020-06-11

申请号：US16705504

申请日：2019-12-06

申请人： Jianwei Liu ,  Keith G. Fife ,  Sarp Satir

发明人： Jianwei Liu ,  Keith G. Fife ,  Sarp Satir

IPC分类号： G06K9/00 ,  B06B1/02 ,  H01L27/32

摘要： Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.

公开(公告)号：US20200184176A1

公开(公告)日：2020-06-11

申请号：US16705444

申请日：2019-12-06

申请人： Jianwei Liu ,  Keith G. Fife ,  Tyler S. Ralston

发明人： Jianwei Liu ,  Keith G. Fife ,  Tyler S. Ralston

IPC分类号： G06K9/00 ,  G06F3/041 ,  B06B1/02 ,  H01L27/32

摘要： An ultrasound fingerprint sensor is described. The ultrasound fingerprint sensor may incorporate capacitive ultrasound sensing technology, for example in the form of an array of capacitive ultrasonic transducers. The ultrasound fingerprint sensor may be incorporated into various electronic equipment, such as mobile electronic equipment in the form of smartphones and tablet computers, as well as in biometric sensing equipment, such as fingerprint access terminals.

公开(公告)号：US20200156110A1

公开(公告)日：2020-05-21

申请号：US16683652

申请日：2019-11-14

申请人： Lingyun Miao ,  Keith G. Fife ,  Jianwei Liu ,  Jonathan M. Rothberg

发明人： Lingyun Miao ,  Keith G. Fife ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC分类号： B06B1/02 ,  B81B3/00 ,  B81C1/00

摘要： A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.

公开(公告)号：US20190231312A1

公开(公告)日：2019-08-01

申请号：US16260242

申请日：2019-01-29

申请人： Keith G. Fife ,  Jianwei Liu ,  Andrew Betts

发明人： Keith G. Fife ,  Jianwei Liu ,  Andrew Betts

IPC分类号： A61B8/00

CPC分类号： A61B8/4483 ,  A61B8/54 ,  A61B8/56

摘要： Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

公开(公告)号：US20190336104A1

公开(公告)日：2019-11-07

申请号：US16401630

申请日：2019-05-02

申请人： KEITH G. FIFE ,  Jianwei Liu ,  Joseph Lutsky ,  Sarp Satir ,  Jungwook Yang

发明人： KEITH G. FIFE ,  Jianwei Liu ,  Joseph Lutsky ,  Sarp Satir ,  Jungwook Yang

IPC分类号： A61B8/00 ,  A61B8/06

摘要： An ultrasound device is described. The ultrasound device may include a cavity, a membrane, and a sensing electrode. When an electrical signal is applied to the sensing electrode and a static bias is applied to the membrane, the membrane vibrates within the cavity and produces ultrasonic signals. The cavity, the membrane, and the sensing electrode may be considered a capacitive micromachined ultrasonic transducer (CMUT). The sensing electrode may be shaped as a ring, whereby the central portion of the sensing electrode is removed. Removal of the central portion of the sensing electrode may reduce the parasitic capacitance without substantially affecting the production of ultrasonic signals by the CMUT. This, in turn, can result in an increase in the signal-to-noise ratio (SNR) of the ultrasonic signals. The ultrasound device may further include a bond pad configured for wire bonding, and a trench electrically isolating the bond pad from the membrane.

公开(公告)号：US20210403321A1

公开(公告)日：2021-12-30

申请号：US17362834

申请日：2021-06-29

申请人： Jianwei Liu ,  Keith G. Fife

发明人： Jianwei Liu ,  Keith G. Fife

IPC分类号： B81C1/00 ,  B06B1/02 ,  B81B7/00 ,  B81B3/00

摘要： Micromachined ultrasonic transducers having a self-assembled monolayer formed on a surface of a sealed cavity are described. A micromachined ultrasonic transducer may include a flexible membrane configured to vibrate over a sealed cavity, and the self-assembled monolayer may coat some or all of the interior surfaces of the sealed cavity. During fabrication, the sealed cavity may be formed by bonding the membrane to a substrate such that the sealed cavity is between the membrane and the substrate. An access hole may be formed through the membrane to the sealed cavity and the self-assembled monolayer is formed on surface(s) of the sealed cavity by introducing precursors into the sealed cavity through the access hole.

公开(公告)号：US20190336099A1

公开(公告)日：2019-11-07

申请号：US16401870

申请日：2019-05-02

申请人： Keith G. Fife ,  Jianwei Liu ,  Jungwook Yang ,  Joseph Lutsky

发明人： Keith G. Fife ,  Jianwei Liu ,  Jungwook Yang ,  Joseph Lutsky

IPC分类号： A61B8/12 ,  B06B1/02 ,  G01N29/24 ,  B06B1/06 ,  H01L41/09

摘要： Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.

公开(公告)号：US20200324318A1

公开(公告)日：2020-10-15

申请号：US16844837

申请日：2020-04-09

申请人： Jianwei Liu ,  Lingyun Miao

发明人： Jianwei Liu ,  Lingyun Miao

IPC分类号： B06B1/02 ,  B81B7/00 ,  B81C1/00 ,  G01N29/24

摘要： An ultrasonic transducer device includes a bottom electrode layer of a transducer cavity disposed over a substrate, and a plurality of vias that electrically connect the bottom electrode layer with the substrate. A bottom cavity layer is disposed over the bottom electrode layer, and one or more openings are formed in the bottom cavity layer so as to expose a region of the bottom electrode layer, wherein locations of the one or more openings are segments that are disposed proximate an outer perimeter of the transducer cavity and substantially correspond to locations where the plurality of vias are not disposed directly beneath.

公开(公告)号：US08775829B2

公开(公告)日：2014-07-08

申请号：US12703995

申请日：2010-02-11

申请人： Xianfang Wang ,  Xiaoyong Dong ,  Linlin Pi ,  Jianwei Liu

发明人： Xianfang Wang ,  Xiaoyong Dong ,  Linlin Pi ,  Jianwei Liu

IPC分类号： G06F1/00

CPC分类号： G06F1/266

摘要： A single phase line switch having a phase line input connected to a phase line of the electric network and a phase line output connected to a negative line of the electric network via resistive loads or capacitive loads. The single phase line includes a first power supply unit connected between the phase line input and the phase line output, a second power supply unit, a controlled switch configured to control the second power unit to be on or off, and a micro control unit (MCU) configured to control the controlled switch to be switched on or off. The first power supply unit is configured to provide a power supply to the MCU when the controlled switch is off. The second power unit is configured to provide a power supply to the MCU and the controlled switch when the controlled switch is on, the second power supply unit being serially connected with the controlled switch, the second power supply and the controlled switch being parallel connected with the first power supply unit. The first power supply unit and the second power supply unit each comprises a voltage output terminal connected to a power supply end of the MCU.

摘要翻译： 具有连接到电网的相线的相线输入的单相线路开关和通过电阻性负载或电容性负载连接到电网的负极线的相线输出。 单相线包括连接在相线输入和相线输出之间的第一电源单元，第二电源单元，被配置为控制第二电源单元导通或关断的受控开关，以及微控制单元 MCU），其被配置为控制受控开关的接通或断开。 第一电源单元被配置为当受控开关断开时向MCU提供电源。 第二电源单元被配置为当受控开关接通时向MCU和受控开关提供电源，第二电源单元与受控开关串联，第二电源和受控开关并联连接 第一个电源单元。 第一电源单元和第二电源单元各自包括连接到MCU的电源端的电压输出端子。

公开(公告)号：US20120069480A1

公开(公告)日：2012-03-22

申请号：US13254542

申请日：2009-12-30

申请人： Xianfang Wang ,  Yonglian Yang ,  Baoning Deng ,  Gang Zhou ,  Jianwei Liu ,  Xiaoyong Dong ,  Linlin Pi

发明人： Xianfang Wang ,  Yonglian Yang ,  Baoning Deng ,  Gang Zhou ,  Jianwei Liu ,  Xiaoyong Dong ,  Linlin Pi

IPC分类号： H02H3/08

CPC分类号： H05B39/04

摘要： The invention relates to a method for providing short-circuit protection for a resistive AC load, wherein the load is connected with an AC power supply through an active controlled switch controlled by a controller. The method for providing short-circuit protection for the resistive AC load comprises the following steps of: turning on the active controlled switch within a first conduction angle range; obtaining the mean current value of the load through a current detection circuit; and determining whether the mean current value of the load is greater than a default value or not, wherein, if so, the active controlled switch is controlled to be turned off, and if not, the active controlled switch is controlled to be turned on. The invention also relates to a device and a switch for providing short-circuit protection for the resistive AC load. The method, the device and the switch for providing short-circuit protection for the resistive AC load, which are provided by the invention, have the advantages that: when the switch is required to be turned on, the switch is turned on first within the first conduction angle range which cannot cause damage to the switch and the circuit and then whether the switch is continued to be turned on or not is determined by determining whether the resistive AC load is subjected to a short circuit or not through the obtained current value; therefore, the switch and the circuit which are connected with the load can be protected while the resistive AC load in a short-circuit condition can be detected.

摘要翻译： 本发明涉及一种用于为电阻式AC负载提供短路保护的方法，其中负载通过由控制器控制的主动控制开关与AC电源连接。 为电阻交流负载提供短路保护的方法包括以下步骤：在第一导通角范围内接通主动受控开关; 通过电流检测电路获得负载的平均电流值; 并且确定负载的平均电流值是否大于默认值，其中如果是，则主动控制开关被控制为关闭，如果不是，则将主动控制开关控制为接通。 本发明还涉及一种用于为电阻式AC负载提供短路保护的装置和开关。 本发明提供的用于为电阻式AC负载提供短路保护的方法，装置和开关具有以下优点：当开关需要接通时，开关首先在 通过确定电阻性AC负载是否通过所获得的电流值进行短路来确定不会对开关和电路造成损害，然后开关是否继续导通的第一导通角范围; 因此，可以在可以检测到短路状态下的电阻式AC负载的同时保护与负载连接的开关和电路。