公开(公告)号：US20070221530A1

公开(公告)日：2007-09-27

申请号：US11384372

申请日：2006-03-21

申请人： Jihee Lee

发明人： Jihee Lee

IPC分类号： B65D81/02

CPC分类号： B65D81/052

摘要： Disclosed are a packing box equipped with an airbag for shock-absorbing and a manufacturing method thereof, in which the airbag consisting of a plurality of air cells is integrally formed with an inner surf ace of the packing box by means of heat and pressure, instead of installing a separate shock-absorbing member in the packing box, and then air is injected into the airbag, wherein the air cells of the airbag have their own one-way valves, respectively, so the shock-absorbing function of the airbag is continuously maintained even if some air cells are broken, and additionally support square bars are integrally formed with a lower surface of the packing box, thereby further absorbing impact applied to the packing box.

摘要翻译： 公开了一种配备有用于减震的气囊的包装盒及其制造方法，其中由多个气囊组成的气囊通过热和压力与包装箱的内部冲压件一体地形成 在包装箱中安装单独的减震构件，然后将空气注入到气囊中，其中气囊的气囊分别具有它们自己的单向阀，因此气囊的减震功能是连续的 即使有一些空气泡破裂，并且另外支撑方棒与包装箱的下表面一体地形成，从而进一步吸收施加到包装盒上的冲击。

公开(公告)号：US20210328564A1

公开(公告)日：2021-10-21

申请号：US17232088

申请日：2021-04-15

申请人： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

发明人： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

IPC分类号： H03F3/45 ,  H03F1/32 ,  H03K5/24 ,  H03M3/00 ,  A61B8/00

摘要： Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.

公开(公告)号：US20210325349A1

公开(公告)日：2021-10-21

申请号：US17232100

申请日：2021-04-15

申请人： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

发明人： Chao Chen ,  Youn-Jae Kook ,  Jihee Lee ,  Kailiang Chen ,  Leung Kin Chiu ,  Joseph Lutsky ,  Nevada J. Sanchez ,  Sebastian Schaetz ,  Hamid Soleimani

IPC分类号： G01N29/24 ,  B06B1/02 ,  G01S15/89 ,  G01S7/52

摘要： Aspects of the technology described herein relate to built-in self-testing (BIST) of circuitry (e.g., a pulser or receive circuitry) and/or transducers in an ultrasound device. A BIST circuit may include a transconductance amplifier coupled between a pulser and receive circuitry, a capacitor network coupled between a pulser and receive circuitry, and/or a current source couplable to the input terminal of receive circuitry to which a transducer is also couplable. The collapse voltages of transducers may be characterized using BIST circuitry, and a bias voltage may be applied to the membranes of the transducers based at least in part on their collapse voltages. The capacitances of transducers may also be measured using BIST circuitry and a notification may be generated based on the sets of measurements.