Substrate carrier
    1.
    发明申请
    Substrate carrier 有权
    基板载体

    公开(公告)号:US20050109668A1

    公开(公告)日:2005-05-26

    申请号:US10971714

    申请日:2004-10-22

    IPC分类号: B65D85/00 H01L20060101

    摘要: A carrier for transporting silicon semiconductor wafers during semiconductor wafer processing operations including an enclosure, a door and a flange structured to interface with a machine so that the carrier can be lifted by the machine. A lift saddle connects the flange to the container so that the load on the flange is transferred to a part of the enclosure other than the top of the enclosure to prevent distortion of the enclosure to maintaining seal integrity between the enclosure and the door.

    摘要翻译: 一种用于在半导体晶片处理操作期间传输硅半导体晶片的载体,包括壳体,门和与机器接合的凸缘和凸缘,使得载体能够被机器提升。 提升鞍座将法兰连接到容器,使得法兰上的负载被转移到外壳的除了外壳的顶部之外的一部分,以防止外壳变形,以保持外壳和门之间的密封完整性。

    Substrate carrier
    2.
    发明授权
    Substrate carrier 有权
    基板载体

    公开(公告)号:US07347329B2

    公开(公告)日:2008-03-25

    申请号:US10971714

    申请日:2004-10-22

    IPC分类号: B65D85/00

    摘要: A carrier for transporting silicon semiconductor wafers during semiconductor wafer processing operations including an enclosure, a door and a flange structured to interface with a machine so that the carrier can be lifted by the machine. A lift saddle connects the flange to the container so that the load on the flange is transferred to a part of the enclosure other than the top of the enclosure to prevent distortion of the enclosure to maintaining seal integrity between the enclosure and the door.

    摘要翻译: 一种用于在半导体晶片处理操作期间传输硅半导体晶片的载体,包括壳体,门和与机器接合的凸缘和凸缘,使得载体能够被机器提升。 提升鞍座将法兰连接到容器,使得法兰上的负载被转移到外壳的除了外壳的顶部之外的一部分,以防止外壳变形,以保持外壳和门之间的密封完整性。

    Wafer container cushion system
    3.
    发明授权
    Wafer container cushion system 有权
    晶圆容器缓冲系统

    公开(公告)号:US06644477B2

    公开(公告)日:2003-11-11

    申请号:US10317006

    申请日:2002-12-11

    IPC分类号: B65D8530

    CPC分类号: H01L21/67369

    摘要: A wafer container having a container portion with an open front for receiving and removal of wafers includes a door with a cushion system that utilizes a unique wafer restraint system and structural features to provide maximum protection for the wafers and preventing rotation of said wafers. A feature of the door is that the front of the door covers have a pair of latch cavities on the outwardly facing side of the door. The latch cavities for receiving two latch mechanisms with latch members that extend out the upper and lower peripheral edge of the door. The latch mechanisms are covered by a pair of door panels that utilize hooks that attach to the peripheral edge of the door and further attach with posts near the vertical midsection. The latch cover at the peripheral side edge and at the vertical midsection of the door provides stiffness and resistance to bending of the door. In a preferred embodiment, the attachment of the door panel at the peripheral edge utilizes hook members on the door panel that extend through slots on the peripheral side. Press fit connectors and aperture combinations are preferably utilized to connect the edge of the latch panel approximate the mid-portion of the door.

    摘要翻译: 具有容器部分的容器部分的具有用于接收和移除晶片的开放前部的晶片容器包括具有缓冲系统的门,其利用独特的晶片约束系统和结构特征来为晶片提供最大的保护并防止所述晶片的旋转。 门的特征在于门盖的前部在门的向外侧面上具有一对闩锁腔。 用于接收具有延伸出门的上周边和下周边的闩锁构件的两个闩锁机构的闩锁腔。 闩锁机构由一对门板覆盖,门板利用连接到门的外围边缘的钩子,并进一步附加在垂直中央部分附近的柱子。 门的周边侧边缘和垂直中央处的锁盖提供刚度和抵抗门弯曲的能力。 在一个优选实施例中,门板在周边边缘处的连接利用门板上的钩构件延伸穿过周边的槽。 压配合连接器和孔组合优选地用于将闩锁板的边缘接近门的中部。

    Protective shipper
    4.
    发明申请
    Protective shipper 审中-公开

    公开(公告)号:US20060201847A1

    公开(公告)日:2006-09-14

    申请号:US11430710

    申请日:2006-05-09

    IPC分类号: B65D85/30

    摘要: A protective shipper comprises a cover and a base that are held together by a latching member. The base is configurable to retain and protect semiconductor wafers or film frames with wafers within a storage pocket. The base comprises latching member and a support wall that defines a storage pocket. The cover encloses the storage pocket. One or both of the cover may receive recesses for gripability. The cover may receive one or more latching apertures configured to minimize unintended unlatching. The shipper of the present invention may be manufactured in a mold capable of producing film frame or wafer containing configurations of the shipper by using an interchangeable mold insert.

    300MM single stackable film frame carrier
    5.
    发明授权
    300MM single stackable film frame carrier 失效
    300MM单层可叠膜架

    公开(公告)号:US06837374B2

    公开(公告)日:2005-01-04

    申请号:US10195134

    申请日:2002-07-12

    CPC分类号: H01L21/67346 Y10S206/821

    摘要: An interlockable film frame carrier has central and peripheral portions for securely storing a film frame, the film frame supporting a film, a semiconductor wafer disposed on the film. The central portion has structure for supporting the semiconductor wafer and for allowing access to a lower surface of the stored film frame. The peripheral portion of the film frame carrier includes structure for supporting a peripheral portion of the film frame and matable stacking members. When the film frame is stored, two film frame carriers are interlocked by mating the stacking members. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR §1.72 (b).

    Protective shipper
    6.
    发明授权

    公开(公告)号:US07040487B2

    公开(公告)日:2006-05-09

    申请号:US10194438

    申请日:2002-07-12

    IPC分类号: B65D85/48

    摘要: A protective shipper comprises a cover and a base that are held together by a latching member. The base is configurable to retain and protect semiconductor wafers or film frames with wafers within a storage pocket. The base comprises latching member and a support wall that defines a storage pocket. The cover encloses the storage pocket. One or both of the cover may receive recesses for gripability. The cover may receive one or more latching apertures configured to minimize unintended unlatching. The shipper of the present invention may be manufactured in a mold capable of producing film frame or wafer containing configurations of the shipper by using an interchangeable mold insert.