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公开(公告)号:US08233261B2
公开(公告)日:2012-07-31
申请号:US12514822
申请日:2007-12-11
Applicant: John D Summers , Tsutomu Mutoh
Inventor: John D Summers , Tsutomu Mutoh
CPC classification number: H05K1/162 , H01G4/224 , H01L23/50 , H01L2924/0002 , H05K3/1291 , H05K2201/0154 , H05K2201/0158 , H05K2201/0187 , H05K2201/0355 , H05K2201/09763 , H05K2203/1126 , H01L2924/00
Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Abstract translation: 本发明涉及组合物,以及这些组合物用于保护涂层,特别是电子器件的用途。 本发明涉及一种涂覆有复合密封剂并嵌入印刷线路板的烧制箔陶瓷电容器。
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公开(公告)号:US06476182B1
公开(公告)日:2002-11-05
申请号:US09741942
申请日:2000-12-21
Applicant: Brian C Auman , William R Corcoran, Jr. , John D Summers
Inventor: Brian C Auman , William R Corcoran, Jr. , John D Summers
IPC: C08G7310
CPC classification number: C08G73/1017 , C08G73/1014 , C08G73/1042 , C08G73/14
Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
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